Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Grant Kloster — 59 Patents

Intel: 59 patents #505 of 30,777Top 2%
Lake Oswego, OR: #20 of 769 inventorsTop 3%
Oregon: #536 of 28,073 inventorsTop 2%
Overall (All Time): #40,067 of 4,157,543Top 1%
59 Patents All Time
Grant Kloster has been granted 59 US patents while listed as an inventor at Intel. The first was granted in 2003 and the most recent in August 2025. Grant Kloster ranks #40,067 of 4,157,543 US inventors in our database (top 0.96%). Patent records list Grant Kloster in Lake Oswego, OR, US.

Issued Patents All Time

Showing 1–25 of 59 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12381161 Backside wafer treatments to reduce distortions and overlay errors during wafer chucking Tayseer Mahdi, Florian Gstrein 2025-08-05
12165987 Frame reveals with maskless lithography in the manufacture of integrated circuits Robert L. Bristol 2024-12-10 $13,394,000
11532724 Selective gate spacers for semiconductor devices Scott B. Clendenning, Szuya S. Liao, Florian Gstrein, Rami Hourani, Patricio E. Romero +1 more 2022-12-20 $12,719,000
10971600 Selective gate spacers for semiconductor devices Scott B. Clendenning, Szuya S. Liao, Florian Gstrein, Rami Hourani, Patricio E. Romero +1 more 2021-04-06 $36,336,000
10756215 Selective deposition utilizing sacrificial blocking layers for semiconductor devices Scott B. Clendenning, Rami Hourani, Szuya S. Liao, Patricio E. Romero, Florian Gstrein 2020-08-25 $27,661,000
10396176 Selective gate spacers for semiconductor devices Scott B. Clendenning, Szuya S. Liao, Florian Gstrein, Rami Hourani, Patricio E. Romero +1 more 2019-08-27 $17,353,000
10243080 Selective deposition utilizing sacrificial blocking layers for semiconductor devices Scott B. Clendenning, Rami Hourani, Szuya S. Liao, Patricio E. Romero, Florian Gstrein 2019-03-26 $18,583,000
9932671 Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD) James M. Blackwell, Patricio E. Romero, Scott B. Clendenning, Florian Gstrein, Harsono S. Simka +2 more 2018-04-03 $16,515,000
9530733 Forming layers of materials over small regions by selective chemical reaction including limiting enchroachment of the layers over adjacent regions Robert L. Bristol, James M. Blackwell, Scott B. Clendenning, Florian Gstrein, Eungnak Han +3 more 2016-12-27 $11,980,000
8154121 Polymer interlayer dielectric and passivation materials for a microelectronic device Kunal Gaurang Shah, Michael Haverty, Sadasivan Shankar, Doug B. Ingerly 2012-04-10 $33,757,000
7658975 Sealing porous dielectric materials Robert Meagley, Michael Goodner, Kevin P. O'Brien 2010-02-09 $29,195,000
7560165 Sealing porous dielectric materials Robert Meagley, Michael Goodner, Kevin P. O'Brien, Don Bruner 2009-07-14 $21,399,000
7544896 Forming a porous dielectric layer and structures formed thereby Boyan Boyanov, Vijay Ramachandrarao, Hyun-Mog Park 2009-06-09 $25,076,000
7456490 Sealing porous dielectrics with silane coupling reagents Chih-I Wu, Xiaorong Morrow 2008-11-25 $14,078,000
7422020 Aluminum incorporation in porous dielectric for improved mechanical properties of patterned dielectric Vijayakumar Ramachandrarao 2008-09-09 $18,766,000
7365375 Organic-framework zeolite interlayer dielectrics Michael Goodner, Mansour Moinpour, Boyan Boyanov 2008-04-29 $13,885,000
7354862 Thin passivation layer on 3D devices Lawrence Wong, Lawrence Foley 2008-04-08 $22,423,000
7344972 Photosensitive dielectric layer Michael Goodner, Kevin P. O'Brien, Robert Meagley 2008-03-18 $17,443,000
7335586 Sealing porous dielectric material using plasma-induced surface polymerization Vijayakumar Ramachandrarao, Boyan Boyanov, Hyun-Mog Park 2008-02-26 $16,748,000
7332406 Air gap interconnect structure and method Hyun-Mog Park 2008-02-19 $15,849,000
7320928 Method of forming a stacked device filler David Staintes, Shriram Ramanathan 2008-01-22 $26,995,000
7303989 Using zeolites to improve the mechanical strength of low-k interlayer dielectrics Boyan Boyanov, Michael Goodner 2007-12-04 $21,616,000
7294568 Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structures Michael Goodner, Kevin P. O'Brien 2007-11-13 $26,433,000
7294934 Low-K dielectric structure and method Xiarong Morrow, Jihperng Leu 2007-11-13 $26,433,000
7238604 Forming thin hard mask over air gap or porous dielectric Kevin P. O'Brien, David H. Gracias, Hyun-Mog Park, Vijayakumar Ramachandrarao 2007-07-03 $20,127,000