Issued Patents All Time
Showing 25 most recent of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381161 | Backside wafer treatments to reduce distortions and overlay errors during wafer chucking | Tayseer Mahdi, Florian Gstrein | 2025-08-05 |
| 12165987 | Frame reveals with maskless lithography in the manufacture of integrated circuits | Robert L. Bristol | 2024-12-10 |
| 11532724 | Selective gate spacers for semiconductor devices | Scott B. Clendenning, Szuya S. Liao, Florian Gstrein, Rami Hourani, Patricio E. Romero +1 more | 2022-12-20 |
| 10971600 | Selective gate spacers for semiconductor devices | Scott B. Clendenning, Szuya S. Liao, Florian Gstrein, Rami Hourani, Patricio E. Romero +1 more | 2021-04-06 |
| 10756215 | Selective deposition utilizing sacrificial blocking layers for semiconductor devices | Scott B. Clendenning, Rami Hourani, Szuya S. Liao, Patricio E. Romero, Florian Gstrein | 2020-08-25 |
| 10396176 | Selective gate spacers for semiconductor devices | Scott B. Clendenning, Szuya S. Liao, Florian Gstrein, Rami Hourani, Patricio E. Romero +1 more | 2019-08-27 |
| 10243080 | Selective deposition utilizing sacrificial blocking layers for semiconductor devices | Scott B. Clendenning, Rami Hourani, Szuya S. Liao, Patricio E. Romero, Florian Gstrein | 2019-03-26 |
| 9932671 | Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD) | James M. Blackwell, Patricio E. Romero, Scott B. Clendenning, Florian Gstrein, Harsono S. Simka +2 more | 2018-04-03 |
| 9530733 | Forming layers of materials over small regions by selective chemical reaction including limiting enchroachment of the layers over adjacent regions | Robert L. Bristol, James M. Blackwell, Scott B. Clendenning, Florian Gstrein, Eungnak Han +3 more | 2016-12-27 |
| 8154121 | Polymer interlayer dielectric and passivation materials for a microelectronic device | Kunal Gaurang Shah, Michael Haverty, Sadasivan Shankar, Doug B. Ingerly | 2012-04-10 |
| 7658975 | Sealing porous dielectric materials | Robert Meagley, Michael Goodner, Kevin P. O'Brien | 2010-02-09 |
| 7560165 | Sealing porous dielectric materials | Robert Meagley, Michael Goodner, Kevin P. O'Brien, Don Bruner | 2009-07-14 |
| 7544896 | Forming a porous dielectric layer and structures formed thereby | Boyan Boyanov, Vijay Ramachandrarao, Hyun-Mog Park | 2009-06-09 |
| 7456490 | Sealing porous dielectrics with silane coupling reagents | Chih-I Wu, Xiaorong Morrow | 2008-11-25 |
| 7422020 | Aluminum incorporation in porous dielectric for improved mechanical properties of patterned dielectric | Vijayakumar Ramachandrarao | 2008-09-09 |
| 7365375 | Organic-framework zeolite interlayer dielectrics | Michael Goodner, Mansour Moinpour, Boyan Boyanov | 2008-04-29 |
| 7354862 | Thin passivation layer on 3D devices | Lawrence Wong, Lawrence Foley | 2008-04-08 |
| 7344972 | Photosensitive dielectric layer | Michael Goodner, Kevin P. O'Brien, Robert Meagley | 2008-03-18 |
| 7335586 | Sealing porous dielectric material using plasma-induced surface polymerization | Vijayakumar Ramachandrarao, Boyan Boyanov, Hyun-Mog Park | 2008-02-26 |
| 7332406 | Air gap interconnect structure and method | Hyun-Mog Park | 2008-02-19 |
| 7320928 | Method of forming a stacked device filler | David Staintes, Shriram Ramanathan | 2008-01-22 |
| 7303989 | Using zeolites to improve the mechanical strength of low-k interlayer dielectrics | Boyan Boyanov, Michael Goodner | 2007-12-04 |
| 7294568 | Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structures | Michael Goodner, Kevin P. O'Brien | 2007-11-13 |
| 7294934 | Low-K dielectric structure and method | Xiarong Morrow, Jihperng Leu | 2007-11-13 |
| 7238604 | Forming thin hard mask over air gap or porous dielectric | Kevin P. O'Brien, David H. Gracias, Hyun-Mog Park, Vijayakumar Ramachandrarao | 2007-07-03 |