VR

Vijayakumar Ramachandrarao

IN Intel: 24 patents #1,642 of 30,777Top 6%
Overall (All Time): #175,253 of 4,157,543Top 5%
24
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8080475 Removal chemistry for selectively etching metal hard mask Kanwal Jit Singh 2011-12-20
8017568 Cleaning residues from semiconductor structures Shan Clark, Robert Turkot 2011-09-13
7977228 Methods for the formation of interconnects separated by air gaps — 2011-07-12
7605073 Sealants for metal interconnect protection in microelectronic devices having air gap interconnect structures Adrien LaVoie, Arnel M. Fajardo 2009-10-20
7422020 Aluminum incorporation in porous dielectric for improved mechanical properties of patterned dielectric Grant Kloster 2008-09-09
7374867 Enhancing photoresist performance using electric fields Robert L. Bristol, Heidi Cao, Manish Chandhok, Robert Meagley 2008-05-20
7335586 Sealing porous dielectric material using plasma-induced surface polymerization Boyan Boyanov, Grant Kloster, Hyun-Mog Park 2008-02-26
7303648 Via etch process Hyun-Mog Park 2007-12-04
7268015 Method for wafer stacking using copper structures of substantially uniform height Shriram Ramanathan 2007-09-11
7238604 Forming thin hard mask over air gap or porous dielectric Grant Kloster, Kevin P. O'Brien, David H. Gracias, Hyun-Mog Park 2007-07-03
7233068 Filling small dimension vias using supercritical carbon dioxide Robert Turkot 2007-06-19
7220668 Method of patterning a porous dielectric material Hyun-Mog Park, Boyan Boyanov, Grant Kloster 2007-05-22
7214605 Deposition of diffusion barrier Shriram Ramanathan, Grant Kloster, Patrick Morrow, Scott List 2007-05-08
7179757 Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials David H. Gracias 2007-02-20
7101443 Supercritical carbon dioxide-based cleaning of metal lines — 2006-09-05
7049053 Supercritical carbon dioxide to reduce line edge roughness Hyun-Mog Park, Subramanyam Iyer, Bob Turkot 2006-05-23
7038324 Wafer stacking using interconnect structures of substantially uniform height Shriram Ramanathan 2006-05-02
7022655 Highly polar cleans for removal of residues from semiconductor structures Justin K. Brask, Robert Turkot 2006-04-04
7018938 Controlled use of photochemically susceptible chemistries for etching, cleaning and surface conditioning Subramanyam Iyer, Justin K. Brask 2006-03-28
7005390 Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials David H. Gracias 2006-02-28
6974762 Adhesion of carbon doped oxides by silanization David H. Gracias 2005-12-13
6812132 Filling small dimension vias using supercritical carbon dioxide Robert Turkot 2004-11-02
6624127 Highly polar cleans for removal of residues from semiconductor structures Justin K. Brask, Robert Turkot 2003-09-23
6620741 Method for controlling etch bias of carbon doped oxide films David H. Gracias, Hyun-Mog Park 2003-09-16