Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080475 | Removal chemistry for selectively etching metal hard mask | Kanwal Jit Singh | 2011-12-20 |
| 8017568 | Cleaning residues from semiconductor structures | Shan Clark, Robert Turkot | 2011-09-13 |
| 7977228 | Methods for the formation of interconnects separated by air gaps | — | 2011-07-12 |
| 7605073 | Sealants for metal interconnect protection in microelectronic devices having air gap interconnect structures | Adrien LaVoie, Arnel M. Fajardo | 2009-10-20 |
| 7422020 | Aluminum incorporation in porous dielectric for improved mechanical properties of patterned dielectric | Grant Kloster | 2008-09-09 |
| 7374867 | Enhancing photoresist performance using electric fields | Robert L. Bristol, Heidi Cao, Manish Chandhok, Robert Meagley | 2008-05-20 |
| 7335586 | Sealing porous dielectric material using plasma-induced surface polymerization | Boyan Boyanov, Grant Kloster, Hyun-Mog Park | 2008-02-26 |
| 7303648 | Via etch process | Hyun-Mog Park | 2007-12-04 |
| 7268015 | Method for wafer stacking using copper structures of substantially uniform height | Shriram Ramanathan | 2007-09-11 |
| 7238604 | Forming thin hard mask over air gap or porous dielectric | Grant Kloster, Kevin P. O'Brien, David H. Gracias, Hyun-Mog Park | 2007-07-03 |
| 7233068 | Filling small dimension vias using supercritical carbon dioxide | Robert Turkot | 2007-06-19 |
| 7220668 | Method of patterning a porous dielectric material | Hyun-Mog Park, Boyan Boyanov, Grant Kloster | 2007-05-22 |
| 7214605 | Deposition of diffusion barrier | Shriram Ramanathan, Grant Kloster, Patrick Morrow, Scott List | 2007-05-08 |
| 7179757 | Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials | David H. Gracias | 2007-02-20 |
| 7101443 | Supercritical carbon dioxide-based cleaning of metal lines | — | 2006-09-05 |
| 7049053 | Supercritical carbon dioxide to reduce line edge roughness | Hyun-Mog Park, Subramanyam Iyer, Bob Turkot | 2006-05-23 |
| 7038324 | Wafer stacking using interconnect structures of substantially uniform height | Shriram Ramanathan | 2006-05-02 |
| 7022655 | Highly polar cleans for removal of residues from semiconductor structures | Justin K. Brask, Robert Turkot | 2006-04-04 |
| 7018938 | Controlled use of photochemically susceptible chemistries for etching, cleaning and surface conditioning | Subramanyam Iyer, Justin K. Brask | 2006-03-28 |
| 7005390 | Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials | David H. Gracias | 2006-02-28 |
| 6974762 | Adhesion of carbon doped oxides by silanization | David H. Gracias | 2005-12-13 |
| 6812132 | Filling small dimension vias using supercritical carbon dioxide | Robert Turkot | 2004-11-02 |
| 6624127 | Highly polar cleans for removal of residues from semiconductor structures | Justin K. Brask, Robert Turkot | 2003-09-23 |
| 6620741 | Method for controlling etch bias of carbon doped oxide films | David H. Gracias, Hyun-Mog Park | 2003-09-16 |