Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727183 | Methods and apparatuses to form self-aligned caps | Boyan Boyanov | 2020-07-28 |
| 10593627 | Doric pillar supported maskless airgap structure for capacitance benefit with unlanded via solution | Kevin Lin, Robert L. Bristol | 2020-03-17 |
| 10457548 | Integrating MEMS structures with interconnects and vias | Kevin Lin, Chytra Pawashe, Raseong Kim, Ian A. Young, Robert L. Bristol | 2019-10-29 |
| 10446493 | Methods and apparatuses to form self-aligned caps | Boyan Boyanov | 2019-10-15 |
| 10147639 | Via self alignment and shorting improvement with airgap integration capacitance benefit | Alan M. Myers | 2018-12-04 |
| 10032643 | Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme | Jasmeet S. Chawla, Ruth A. Brain, Richard E. Schenker, Alan M. Myers | 2018-07-24 |
| 9887161 | Techniques for forming interconnects in porous dielectric materials | Christopher J. Jezewski, David J. Michalak, Alan M. Myers | 2018-02-06 |
| 9754886 | Semiconductor interconnect structures | Boyan Boyanov, James S. Clarke, Alan M. Myers | 2017-09-05 |
| 9659869 | Forming barrier walls, capping, or alloys /compounds within metal lines | Christopher J. Jezewski, Alan M Meyers, Tejaswi K. Indukuri, James S. Clarke, Florian Gstrein | 2017-05-23 |
| 9627321 | Methods and apparatuses to form self-aligned caps | Boyan Boyanov | 2017-04-18 |
| 9565766 | Formation of DRAM capacitor among metal interconnect | Nick Lindert, Joseph M. Steigerwald | 2017-02-07 |
| 9553018 | Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects | Robert L. Bristol, Kevin Lin, Alan M. Myers, Richard E. Schenker | 2017-01-24 |
| 9548269 | Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects | Alan M. Myers, Robert L. Bristol, Jasmeet S. Chawla | 2017-01-17 |
| 9455224 | Semiconductor interconnect structures | Boyan Boyanov, James S. Clarke, Alan M. Myers | 2016-09-27 |
| 9406512 | Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects | Robert L. Bristol, James M. Blackwell, Alan M. Myers | 2016-08-02 |
| 9406615 | Techniques for forming interconnects in porous dielectric materials | Christopher J. Jezewski, David J. Michalak, Alan M. Myers | 2016-08-02 |
| 9379010 | Methods for forming interconnect layers having tight pitch interconnect structures | Christopher J. Jezewski, Jasmeet S. Chawla, Alan M. Myers, Elliot N. Tan, Richard E. Schenker | 2016-06-28 |
| 9373584 | Methods and apparatuses to form self-aligned caps | Boyan Boyanov | 2016-06-21 |
| 9236342 | Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects | Robert L. Bristol, Kevin Lin, Alan M. Myers, Richard E. Schenker | 2016-01-12 |
| 9209077 | Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects | Alan M. Myers, Robert L. Bristol, Jasmeet S. Chawla | 2015-12-08 |
| 9064872 | Semiconductor interconnect structures | Boyan Boyanov, James S. Clarke, Alan M. Myers | 2015-06-23 |
| 9041217 | Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects | Robert L. Bristol, James M. Blackwell, Alan M. Myers | 2015-05-26 |
| 8772938 | Semiconductor interconnect structures | Boyan Boyanov, James S. Clarke, Alan M. Myers | 2014-07-08 |
| 8080475 | Removal chemistry for selectively etching metal hard mask | Vijayakumar Ramachandrarao | 2011-12-20 |