| 10727183 |
Methods and apparatuses to form self-aligned caps |
Boyan Boyanov |
2020-07-28 |
$26,273,000 |
| 10593627 |
Doric pillar supported maskless airgap structure for capacitance benefit with unlanded via solution |
Kevin Lin, Robert L. Bristol |
2020-03-17 |
$21,927,000 |
| 10457548 |
Integrating MEMS structures with interconnects and vias |
Kevin Lin, Chytra Pawashe, Raseong Kim, Ian A. Young, Robert L. Bristol |
2019-10-29 |
$25,165,000 |
| 10446493 |
Methods and apparatuses to form self-aligned caps |
Boyan Boyanov |
2019-10-15 |
$18,012,000 |
| 10147639 |
Via self alignment and shorting improvement with airgap integration capacitance benefit |
Alan M. Myers |
2018-12-04 |
$23,085,000 |
| 10032643 |
Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme |
Jasmeet S. Chawla, Ruth A. Brain, Richard E. Schenker, Alan M. Myers |
2018-07-24 |
$23,531,000 |
| 9887161 |
Techniques for forming interconnects in porous dielectric materials |
Christopher J. Jezewski, David J. Michalak, Alan M. Myers |
2018-02-06 |
$17,987,000 |
| 9754886 |
Semiconductor interconnect structures |
Boyan Boyanov, James S. Clarke, Alan M. Myers |
2017-09-05 |
$9,844,000 |
| 9659869 |
Forming barrier walls, capping, or alloys /compounds within metal lines |
Christopher J. Jezewski, Alan M Meyers, Tejaswi K. Indukuri, James S. Clarke, Florian Gstrein |
2017-05-23 |
$7,972,000 |
| 9627321 |
Methods and apparatuses to form self-aligned caps |
Boyan Boyanov |
2017-04-18 |
$8,310,000 |
| 9565766 |
Formation of DRAM capacitor among metal interconnect |
Nick Lindert, Joseph M. Steigerwald |
2017-02-07 |
$9,424,000 |
| 9553018 |
Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects |
Robert L. Bristol, Kevin Lin, Alan M. Myers, Richard E. Schenker |
2017-01-24 |
$12,666,000 |
| 9548269 |
Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects |
Alan M. Myers, Robert L. Bristol, Jasmeet S. Chawla |
2017-01-17 |
$15,866,000 |
| 9455224 |
Semiconductor interconnect structures |
Boyan Boyanov, James S. Clarke, Alan M. Myers |
2016-09-27 |
$16,083,000 |
| 9406512 |
Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects |
Robert L. Bristol, James M. Blackwell, Alan M. Myers |
2016-08-02 |
$8,723,000 |
| 9406615 |
Techniques for forming interconnects in porous dielectric materials |
Christopher J. Jezewski, David J. Michalak, Alan M. Myers |
2016-08-02 |
$8,723,000 |
| 9379010 |
Methods for forming interconnect layers having tight pitch interconnect structures |
Christopher J. Jezewski, Jasmeet S. Chawla, Alan M. Myers, Elliot N. Tan, Richard E. Schenker |
2016-06-28 |
$11,945,000 |
| 9373584 |
Methods and apparatuses to form self-aligned caps |
Boyan Boyanov |
2016-06-21 |
$13,200,000 |
| 9236342 |
Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects |
Robert L. Bristol, Kevin Lin, Alan M. Myers, Richard E. Schenker |
2016-01-12 |
$15,498,000 |
| 9209077 |
Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects |
Alan M. Myers, Robert L. Bristol, Jasmeet S. Chawla |
2015-12-08 |
$12,754,000 |
| 9064872 |
Semiconductor interconnect structures |
Boyan Boyanov, James S. Clarke, Alan M. Myers |
2015-06-23 |
$16,735,000 |
| 9041217 |
Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects |
Robert L. Bristol, James M. Blackwell, Alan M. Myers |
2015-05-26 |
$20,586,000 |
| 8772938 |
Semiconductor interconnect structures |
Boyan Boyanov, James S. Clarke, Alan M. Myers |
2014-07-08 |
$15,420,000 |
| 8080475 |
Removal chemistry for selectively etching metal hard mask |
Vijayakumar Ramachandrarao |
2011-12-20 |
$34,401,000 |
