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Home › Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme

Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme

US Patent 10032643 · Granted Jul 24, 2018

Estimated economic value: $23,531,000 ⓘ

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