| 12394716 |
Integrated circuit interconnect structures with graphene cap |
Carl Naylor, Matthew V. Metz, Sean King, Ramanan V. Chebiam, Mauro J. Kobrinsky +5 more |
2025-08-19 |
|
| 12322699 |
Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches |
Christopher J. Jezewski |
2025-06-03 |
|
| 11380617 |
Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches |
Christopher J. Jezewski |
2022-07-05 |
$18,093,000 |
| 11107908 |
Transistors with metal source and drain contacts including a Heusler alloy |
Sasikanth Manipatruni, Anurag Chaudhry, Dmitri E. Nikonov, Christopher J. Wiegand, Kanwaljit Singh +2 more |
2021-08-31 |
$22,590,000 |
| 11069609 |
Techniques for forming vias and other interconnects for integrated circuit structures |
Sasikanth Manipatruni, Chia-Ching Lin, Dmitri E. Nikonov, Ian A. Young, Robert L. Bristol |
2021-07-20 |
$44,320,000 |
| 11056593 |
Semiconductor devices with metal contacts including crystalline alloys |
Sasikanth Manipatruni, Dmitri E. Nikonov, Uygar E. Avci, Christopher J. Wiegand, Anurag Chaudhry +1 more |
2021-07-06 |
$31,309,000 |
| 10971394 |
Maskless air gap to prevent via punch through |
Manish Chandhok, Todd R. Younkin, Eungnak Han, Marie Krysak, Hui Jae Yoo +1 more |
2021-04-06 |
$36,336,000 |
| 10957844 |
Magneto-electric spin orbit (MESO) structures having functional oxide vias |
Sasikanth Manipatruni, Robert L. Bristol, Chia-Ching Lin, Dmitri E. Nikonov, Ian A. Young |
2021-03-23 |
$29,278,000 |
| 10707186 |
Compliant layer for wafer to wafer bonding |
Mauro J. Kobrinsky, Stefan Meister, Myra McDonnell, Chytra Pawashe, Daniel Pantuso |
2020-07-07 |
$29,601,000 |
| 10546772 |
Self-aligned via below subtractively patterned interconnect |
Manish Chandhok, Richard E. Schenker, Hui Jae Yoo, Kevin Lin, Stephanie A. Bojarski +3 more |
2020-01-28 |
$38,246,000 |
| 10497613 |
Microelectronic conductive routes and methods of making the same |
Rami Hourani, Mauro J. Kobrinsky, Florian Gstrein, Scott B. Clendenning, Jeanette M. Roberts |
2019-12-03 |
$19,496,000 |
| 10256141 |
Maskless air gap to prevent via punch through |
Manish Chandhok, Todd R. Younkin, Eungnak Han, Marie Krysak, Hui Jae Yoo +1 more |
2019-04-09 |
$21,845,000 |
| 10109583 |
Method for creating alternate hardmask cap interconnect structure with increased overlay margin |
Robert L. Bristol, Manish Chandhok, Florian Gstrein, Eungnak Han, Rami Hourani +3 more |
2018-10-23 |
$21,867,000 |
| 10032643 |
Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme |
Ruth A. Brain, Richard E. Schenker, Kanwal Jit Singh, Alan M. Myers |
2018-07-24 |
$23,531,000 |
| 9911694 |
Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches |
Christopher J. Jezewski |
2018-03-06 |
$18,859,000 |
| 9548269 |
Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects |
Alan M. Myers, Kanwal Jit Singh, Robert L. Bristol |
2017-01-17 |
$15,866,000 |
| 9385082 |
Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches |
Christopher J. Jezewski |
2016-07-05 |
$9,080,000 |
| 9379010 |
Methods for forming interconnect layers having tight pitch interconnect structures |
Christopher J. Jezewski, Kanwal Jit Singh, Alan M. Myers, Elliot N. Tan, Richard E. Schenker |
2016-06-28 |
$11,945,000 |
| 9209077 |
Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects |
Alan M. Myers, Kanwal Jit Singh, Robert L. Bristol |
2015-12-08 |
$12,754,000 |
| 9054164 |
Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches |
Christopher J. Jezewski |
2015-06-09 |
$16,785,000 |
