Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11721554 | Stress compensation for wafer to wafer bonding | Anant H. JAHAGIRDAR, Chytra Pawashe, Aaron D. Lilak, Brennen Mueller, Mauro J. Kobrinsky | 2023-08-08 | $22,376,000 |
| 11329162 | Integrated circuit structures having differentiated neighboring partitioned source or drain contact structures | Mauro J. Kobrinsky, Stephanie A. Bojarski, Tahir Ghani | 2022-05-10 | $19,182,000 |
| 11056356 | Fluid viscosity control during wafer bonding | Brennen Mueller, Daniel Pantuso, Mauro J. Kobrinsky, Chytra Pawashe | 2021-07-06 | $31,309,000 |
| 10720345 | Wafer to wafer bonding with low wafer distortion | Mauro J. Kobrinsky, Brennen Mueller, Chytra Pawashe, Daniel Pantuso, Paul B. Fischer +2 more | 2020-07-21 | $33,796,000 |
| 10707186 | Compliant layer for wafer to wafer bonding | Mauro J. Kobrinsky, Jasmeet S. Chawla, Stefan Meister, Chytra Pawashe, Daniel Pantuso | 2020-07-07 | $29,601,000 |