Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176323 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more | 2024-12-24 |
| 11990516 | Quantum dot devices with independent gate control | Hubert C. George, Ravi Pillarisetty, James S. Clarke | 2024-05-21 |
| 11922274 | Quantum dot devices with side and center screening gates | Hubert C. George, James S. Clarke, Ravi Pillarisetty, Stephanie A. Bojarski, Eric M. Henry +4 more | 2024-03-05 |
| 11887887 | Interconnect structures and methods of fabrication | Manish Chandhok, Ramanan V. Chebiam, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more | 2024-01-30 |
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya +3 more | 2023-09-05 |
| 11721554 | Stress compensation for wafer to wafer bonding | Anant H. JAHAGIRDAR, Chytra Pawashe, Aaron D. Lilak, Myra McDonnell, Mauro J. Kobrinsky | 2023-08-08 |
| 11721649 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Shawna M. Liff +2 more | 2023-08-08 |
| 11605565 | Three dimensional integrated circuits with stacked transistors | Cheng-Ying Huang, Willy Rachmady, Gilbert Dewey, Aaron D. Lilak, Kimin Jun +5 more | 2023-03-14 |
| 11594524 | Fabrication and use of through silicon vias on double sided interconnect device | Patrick Morrow, Kimin Jun, Paul B. Fischer, Daniel Pantuso | 2023-02-28 |
| 11532558 | Metallization barrier structures for bonded integrated circuit interfaces | Carl Naylor, Mauro J. Kobrinsky, Richard Vreeland, Ramanan V. Chebiam, William Brezinski +1 more | 2022-12-20 |
| 11532719 | Transistors on heterogeneous bonding layers | Kimin Jun, Jack T. Kavalieros, Gilbert Dewey, Willy Rachmady, Aaron D. Lilak +5 more | 2022-12-20 |
| 11527501 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Liff, Brandon M. Rawlings, Jagat Shakya +3 more | 2022-12-13 |
| 11404307 | Interconnect structures and methods of fabrication | Manish Chandhok, Ramanan V. Chebiam, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more | 2022-08-02 |
| 11393777 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Shawna M. Liff +2 more | 2022-07-19 |
| 11348897 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more | 2022-05-31 |
| 11251156 | Fabrication and use of through silicon vias on double sided interconnect device | Patrick Morrow, Kimin Jun, Paul B. Fischer, Daniel Pantuso | 2022-02-15 |
| 11189585 | Selective recess of interconnects for probing hybrid bond devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Johanna M. Swan, Shawna M. Liff, Pooya Tadayon | 2021-11-30 |
| 11056356 | Fluid viscosity control during wafer bonding | Daniel Pantuso, Mauro J. Kobrinsky, Chytra Pawashe, Myra McDonnell | 2021-07-06 |
| 10720345 | Wafer to wafer bonding with low wafer distortion | Mauro J. Kobrinsky, Myra McDonnell, Chytra Pawashe, Daniel Pantuso, Paul B. Fischer +2 more | 2020-07-21 |
| 9740096 | Positive-tone, chemically amplified, aqueous-developable, permanent dielectric | Paul A. Kohl | 2017-08-22 |