| 12176323 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more |
2024-12-24 |
$17,261,000 |
| 11990516 |
Quantum dot devices with independent gate control |
Hubert C. George, Ravi Pillarisetty, James S. Clarke |
2024-05-21 |
$18,840,000 |
| 11922274 |
Quantum dot devices with side and center screening gates |
Hubert C. George, James S. Clarke, Ravi Pillarisetty, Stephanie A. Bojarski, Eric M. Henry +4 more |
2024-03-05 |
$29,696,000 |
| 11887887 |
Interconnect structures and methods of fabrication |
Manish Chandhok, Ramanan V. Chebiam, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more |
2024-01-30 |
$30,721,000 |
| 11749628 |
Sacrificial redistribution layer in microelectronic assemblies having direct bonding |
Adel A. Elsherbini, Veronica Strong, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya +3 more |
2023-09-05 |
$19,899,000 |
| 11721554 |
Stress compensation for wafer to wafer bonding |
Anant H. JAHAGIRDAR, Chytra Pawashe, Aaron D. Lilak, Myra McDonnell, Mauro J. Kobrinsky |
2023-08-08 |
$22,376,000 |
| 11721649 |
Microelectronic assemblies |
Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Shawna M. Liff +2 more |
2023-08-08 |
$22,376,000 |
| 11605565 |
Three dimensional integrated circuits with stacked transistors |
Cheng-Ying Huang, Willy Rachmady, Gilbert Dewey, Aaron D. Lilak, Kimin Jun +5 more |
2023-03-14 |
$29,588,000 |
| 11594524 |
Fabrication and use of through silicon vias on double sided interconnect device |
Patrick Morrow, Kimin Jun, Paul B. Fischer, Daniel Pantuso |
2023-02-28 |
$10,430,000 |
| 11532558 |
Metallization barrier structures for bonded integrated circuit interfaces |
Carl Naylor, Mauro J. Kobrinsky, Richard Vreeland, Ramanan V. Chebiam, William Brezinski +1 more |
2022-12-20 |
$12,719,000 |
| 11532719 |
Transistors on heterogeneous bonding layers |
Kimin Jun, Jack T. Kavalieros, Gilbert Dewey, Willy Rachmady, Aaron D. Lilak +5 more |
2022-12-20 |
$12,719,000 |
| 11527501 |
Sacrificial redistribution layer in microelectronic assemblies having direct bonding |
Adel A. Elsherbini, Veronica Strong, Shawna M. Liff, Brandon M. Rawlings, Jagat Shakya +3 more |
2022-12-13 |
$11,573,000 |
| 11404307 |
Interconnect structures and methods of fabrication |
Manish Chandhok, Ramanan V. Chebiam, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more |
2022-08-02 |
$13,520,000 |
| 11393777 |
Microelectronic assemblies |
Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Shawna M. Liff +2 more |
2022-07-19 |
$11,394,000 |
| 11348897 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more |
2022-05-31 |
$16,893,000 |
| 11251156 |
Fabrication and use of through silicon vias on double sided interconnect device |
Patrick Morrow, Kimin Jun, Paul B. Fischer, Daniel Pantuso |
2022-02-15 |
$14,138,000 |
| 11189585 |
Selective recess of interconnects for probing hybrid bond devices |
Adel A. Elsherbini, Mauro J. Kobrinsky, Johanna M. Swan, Shawna M. Liff, Pooya Tadayon |
2021-11-30 |
$30,212,000 |
| 11056356 |
Fluid viscosity control during wafer bonding |
Daniel Pantuso, Mauro J. Kobrinsky, Chytra Pawashe, Myra McDonnell |
2021-07-06 |
$31,309,000 |
| 10720345 |
Wafer to wafer bonding with low wafer distortion |
Mauro J. Kobrinsky, Myra McDonnell, Chytra Pawashe, Daniel Pantuso, Paul B. Fischer +2 more |
2020-07-21 |
$33,796,000 |
| 9740096 |
Positive-tone, chemically amplified, aqueous-developable, permanent dielectric |
Paul A. Kohl |
2017-08-22 |
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