Daniel Pantuso — 12 Patents at Intel

Daniel Pantuso has been granted 12 US patents while listed as an inventor at Intel. The first was granted in 2003 and the most recent in February 2023. Daniel Pantuso ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Daniel Pantuso in Portland, OR, US.

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11594524	Fabrication and use of through silicon vias on double sided interconnect device	Brennen Mueller, Patrick Morrow, Kimin Jun, Paul B. Fischer	2023-02-28	$10,430,000
11251156	Fabrication and use of through silicon vias on double sided interconnect device	Brennen Mueller, Patrick Morrow, Kimin Jun, Paul B. Fischer	2022-02-15	$14,138,000
11195719	Reducing in-plane distortion from wafer to wafer bonding using a dummy wafer	Chytra Pawashe	2021-12-07	$28,128,000
11171057	Semiconductor fin design to mitigate fin collapse	Glenn A. Glass, Chytra Pawashe, Anand S. Murthy, Tahir Ghani	2021-11-09	$28,241,000
11056356	Fluid viscosity control during wafer bonding	Brennen Mueller, Mauro J. Kobrinsky, Chytra Pawashe, Myra McDonnell	2021-07-06	$31,309,000
10825752	Integrated thermoelectric cooling	Lei Jiang, Edwin B. Ramayya, Rafael Rios, Kelin J. Kuhn, Seiyon Kim	2020-11-03	$38,832,000
10720345	Wafer to wafer bonding with low wafer distortion	Mauro J. Kobrinsky, Myra McDonnell, Brennen Mueller, Chytra Pawashe, Paul B. Fischer +2 more	2020-07-21	$33,796,000
10707186	Compliant layer for wafer to wafer bonding	Mauro J. Kobrinsky, Jasmeet S. Chawla, Stefan Meister, Myra McDonnell, Chytra Pawashe	2020-07-07	$29,601,000
9691716	Techniques for enhancing fracture resistance of interconnects	Christopher J. Jezewski, Mauro J. Kobrinsky, Siddharth B. Bhingarde, Michael P. O'Day	2017-06-27	$7,334,000
9343411	Techniques for enhancing fracture resistance of interconnects	Christopher J. Jezewski, Mauro J. Kobrinsky, Siddharth B. Bhingarde, Michael P. O'Day	2016-05-17	$8,600,000
6646340	Thermally coupling electrically decoupling cooling device for integrated circuits	Timothy L. Deeter, Thomas Marieb, Daniel James Murray, Sarangapani Sista	2003-11-11	$43,556,000
6525419	Thermally coupling electrically decoupling cooling device for integrated circuits	Timothy L. Deeter, Thomas Marieb, Daniel James Murray, Sarangapani Sista	2003-02-25	$39,445,000

Daniel Pantuso — 12 Patents

Issued Patents All Time

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