Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394716 | Integrated circuit interconnect structures with graphene cap | Carl Naylor, Jasmeet S. Chawla, Matthew V. Metz, Sean King, Ramanan V. Chebiam +5 more | 2025-08-19 |
| 12027458 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2024-07-02 |
| 11990403 | Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom | Kevin Lin, Richard E. Schenker, Rami Hourani, Manish Chandhok | 2024-05-21 |
| 11887887 | Interconnect structures and methods of fabrication | Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Nafees Kabir +2 more | 2024-01-30 |
| 11532558 | Metallization barrier structures for bonded integrated circuit interfaces | Carl Naylor, Mauro J. Kobrinsky, Richard Vreeland, Ramanan V. Chebiam, William Brezinski +1 more | 2022-12-20 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2022-09-13 |
| 11437283 | Backside contacts for semiconductor devices | Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +4 more | 2022-09-06 |
| 11424160 | Self-aligned local interconnects | Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +5 more | 2022-08-23 |
| 11406972 | Activation of protected cross-linking catalysts during formation of dielectric materials | James M. Blackwell, David J. Michalak, Jessica M. Torres, Marie Krysak | 2022-08-09 |
| 11404307 | Interconnect structures and methods of fabrication | Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Nafees Kabir +2 more | 2022-08-02 |
| 11152254 | Pitch quartered three-dimensional air gaps | Manish Chandhok, Sudipto Naskar, Stephanie A. Bojarski, Kevin Lin, Marie Krysak +3 more | 2021-10-19 |
| 11024538 | Hardened plug for improved shorting margin | Kevin Lin, Tayseer Mahdi, Jessica M. Torres, Marie Krysak, James M. Blackwell | 2021-06-01 |
| 11011463 | Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom | Kevin Lin, Richard E. Schenker, Rami Hourani, Manish Chandhok | 2021-05-18 |
| 10868246 | Conductive bridge random access memory (CBRAM) devices with low thermal conductivity electrolyte sublayer | Elijah V. Karpov, Roza Kotlyar, Prashant Majhi | 2020-12-15 |
| 10665781 | Programmable metallization cell with alloy layer | Elijah V. Karpov, James S. Clarke, Ravi Pillarisetty, Uday Shah | 2020-05-26 |
| 10529660 | Pore-filled dielectric materials for semiconductor structure fabrication and their methods of fabrication | Jessica M. Torres, Mauro J. Kobrinsky, Christopher J. Jezewski, Gopinath Bhimarasetti | 2020-01-07 |
| 10483160 | Ultra thin helmet dielectric layer for maskless air gap and replacement ILD processes | Manish Chandhok, Asad Iqbal, John D. Brooks | 2019-11-19 |
| 9269652 | Chemically altered carbosilanes for pore sealing applications | David J. Michalak, James M. Blackwell, James S. Clarke | 2016-02-23 |
| 8461683 | Self-forming, self-aligned barriers for back-end interconnects and methods of making same | Hui Jae Yoo, Sean King, Sridhar Balakrishnan | 2013-06-11 |
| 7772702 | Dielectric spacers for metal interconnects and method to form the same | Boyan Boyanov | 2010-08-10 |
| 6677253 | Carbon doped oxide deposition | Ebrahim Andideh, Kevin Peterson | 2004-01-13 |