| 12482744 |
Subtractively patterned interconnect structures for integrated circuits |
Keh-I Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2025-11-25 |
|
| 12394716 |
Integrated circuit interconnect structures with graphene cap |
Carl Naylor, Jasmeet S. Chawla, Matthew V. Metz, Sean King, Ramanan V. Chebiam +5 more |
2025-08-19 |
|
| 12027458 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2024-07-02 |
$27,114,000 |
| 11990403 |
Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom |
Kevin Lin, Richard E. Schenker, Rami Hourani, Manish Chandhok |
2024-05-21 |
$18,840,000 |
| 11887887 |
Interconnect structures and methods of fabrication |
Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Nafees Kabir +2 more |
2024-01-30 |
$30,721,000 |
| 11532558 |
Metallization barrier structures for bonded integrated circuit interfaces |
Carl Naylor, Mauro J. Kobrinsky, Richard Vreeland, Ramanan V. Chebiam, William Brezinski +1 more |
2022-12-20 |
$12,719,000 |
| 11444024 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2022-09-13 |
$14,653,000 |
| 11437283 |
Backside contacts for semiconductor devices |
Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +4 more |
2022-09-06 |
$12,766,000 |
| 11424160 |
Self-aligned local interconnects |
Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +5 more |
2022-08-23 |
$15,804,000 |
| 11406972 |
Activation of protected cross-linking catalysts during formation of dielectric materials |
James M. Blackwell, David J. Michalak, Jessica M. Torres, Marie Krysak |
2022-08-09 |
$13,688,000 |
| 11404307 |
Interconnect structures and methods of fabrication |
Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Nafees Kabir +2 more |
2022-08-02 |
$13,520,000 |
| 11152254 |
Pitch quartered three-dimensional air gaps |
Manish Chandhok, Sudipto Naskar, Stephanie A. Bojarski, Kevin Lin, Marie Krysak +3 more |
2021-10-19 |
$36,352,000 |
| 11024538 |
Hardened plug for improved shorting margin |
Kevin Lin, Tayseer Mahdi, Jessica M. Torres, Marie Krysak, James M. Blackwell |
2021-06-01 |
$35,542,000 |
| 11011463 |
Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom |
Kevin Lin, Richard E. Schenker, Rami Hourani, Manish Chandhok |
2021-05-18 |
$44,170,000 |
| 10868246 |
Conductive bridge random access memory (CBRAM) devices with low thermal conductivity electrolyte sublayer |
Elijah V. Karpov, Roza Kotlyar, Prashant Majhi |
2020-12-15 |
$39,832,000 |
| 10665781 |
Programmable metallization cell with alloy layer |
Elijah V. Karpov, James S. Clarke, Ravi Pillarisetty, Uday Shah |
2020-05-26 |
$31,191,000 |
| 10529660 |
Pore-filled dielectric materials for semiconductor structure fabrication and their methods of fabrication |
Jessica M. Torres, Mauro J. Kobrinsky, Christopher J. Jezewski, Gopinath Bhimarasetti |
2020-01-07 |
$22,293,000 |
| 10483160 |
Ultra thin helmet dielectric layer for maskless air gap and replacement ILD processes |
Manish Chandhok, Asad Iqbal, John D. Brooks |
2019-11-19 |
$26,843,000 |
| 9269652 |
Chemically altered carbosilanes for pore sealing applications |
David J. Michalak, James M. Blackwell, James S. Clarke |
2016-02-23 |
$10,383,000 |
| 8461683 |
Self-forming, self-aligned barriers for back-end interconnects and methods of making same |
Hui Jae Yoo, Sean King, Sridhar Balakrishnan |
2013-06-11 |
$12,060,000 |
| 7772702 |
Dielectric spacers for metal interconnects and method to form the same |
Boyan Boyanov |
2010-08-10 |
$11,211,000 |
| 6677253 |
Carbon doped oxide deposition |
Ebrahim Andideh, Kevin Peterson |
2004-01-13 |
$61,623,000 |
