| 12482744 |
Subtractively patterned interconnect structures for integrated circuits |
Keh-I Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2025-11-25 |
|
| 12394716 |
Integrated circuit interconnect structures with graphene cap |
Carl Naylor, Jasmeet S. Chawla, Matthew V. Metz, Sean King, Mauro J. Kobrinsky +5 more |
2025-08-19 |
|
| 12354956 |
Cobalt based interconnects and methods of fabrication thereof |
Christopher J. Jezewski, Tejaswi K. Indukuri, Colin T. Carver |
2025-07-08 |
|
| 12266568 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke |
2025-04-01 |
|
| 12027458 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2024-07-02 |
$27,114,000 |
| 11887887 |
Interconnect structures and methods of fabrication |
Manish Chandhok, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more |
2024-01-30 |
$30,721,000 |
| 11881432 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke |
2024-01-23 |
|
| 11862563 |
Cobalt based interconnects and methods of fabrication thereof |
Christopher J. Jezewski, Tejaswi K. Indukuri, Colin T. Carver |
2024-01-02 |
|
| 11569126 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke |
2023-01-31 |
$11,941,000 |
| 11532558 |
Metallization barrier structures for bonded integrated circuit interfaces |
Carl Naylor, Mauro J. Kobrinsky, Richard Vreeland, William Brezinski, Brennen Mueller +1 more |
2022-12-20 |
$12,719,000 |
| 11444024 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2022-09-13 |
$14,653,000 |
| 11404307 |
Interconnect structures and methods of fabrication |
Manish Chandhok, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more |
2022-08-02 |
$13,520,000 |
| 11328993 |
Cobalt based interconnects and methods of fabrication thereof |
Christopher J. Jezewski, Tejaswi K. Indukuri, Colin T. Carver |
2022-05-10 |
$19,182,000 |
| 11094587 |
Use of noble metals in the formation of conductive connectors |
Christopher J. Jezewski, Srijit Mukherjee, Daniel Bergstrom, Tejaswi K. Indukuri, Flavio Griggio +1 more |
2021-08-17 |
$29,127,000 |
| 10832951 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke |
2020-11-10 |
$31,576,000 |
| 10700007 |
Cobalt based interconnects and methods of fabrication thereof |
Christopher J. Jezewski, Tejaswi K. Indukuri, Colin T. Carver |
2020-06-30 |
$33,333,000 |
| 10629525 |
Seam healing of metal interconnects |
Christopher J. Jezewski, Tejaswi K. Indukuri, James S. Clarke, John J. Plombon |
2020-04-21 |
$45,742,000 |
| 10553477 |
Forming interconnects with self-assembled monolayers |
Aranzazu MAESTRE CARO |
2020-02-04 |
$21,361,000 |
| 10068845 |
Seam healing of metal interconnects |
Christopher J. Jezewski, Tejaswi K. Indukuri, James S. Clarke, John J. Plombon |
2018-09-04 |
$19,235,000 |
| 9997457 |
Cobalt based interconnects and methods of fabrication thereof |
Christopher J. Jezewski, Tejaswi K. Indukuri, Colin T. Carver |
2018-06-12 |
$21,622,000 |
| 9691657 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke |
2017-06-27 |
$7,334,000 |
| 9391019 |
Scalable interconnect structures with selective via posts |
Mauro J. Kobrinsky, Tatyana N. Andryushchenko, Hui Jae Yoo |
2016-07-12 |
$10,128,000 |
| 9385085 |
Interconnects with fully clad lines |
Manish Chandhok, Hui Jae Yoo, Christopher J. Jezewski, Colin T. Carver |
2016-07-05 |
$9,080,000 |
| 9349636 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke |
2016-05-24 |
$13,693,000 |
| 9165824 |
Interconnects with fully clad lines |
Manish Chandhok, Hui Jae Yoo, Christopher J. Jezewski, Colin T. Carver |
2015-10-20 |
$14,675,000 |
