Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394716 | Integrated circuit interconnect structures with graphene cap | Carl Naylor, Jasmeet S. Chawla, Matthew V. Metz, Sean King, Mauro J. Kobrinsky +5 more | 2025-08-19 |
| 12354956 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, Tejaswi K. Indukuri, Colin T. Carver | 2025-07-08 |
| 12266568 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke | 2025-04-01 |
| 12027458 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2024-07-02 |
| 11887887 | Interconnect structures and methods of fabrication | Manish Chandhok, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more | 2024-01-30 |
| 11881432 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke | 2024-01-23 |
| 11862563 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, Tejaswi K. Indukuri, Colin T. Carver | 2024-01-02 |
| 11569126 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke | 2023-01-31 |
| 11532558 | Metallization barrier structures for bonded integrated circuit interfaces | Carl Naylor, Mauro J. Kobrinsky, Richard Vreeland, William Brezinski, Brennen Mueller +1 more | 2022-12-20 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2022-09-13 |
| 11404307 | Interconnect structures and methods of fabrication | Manish Chandhok, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more | 2022-08-02 |
| 11328993 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, Tejaswi K. Indukuri, Colin T. Carver | 2022-05-10 |
| 11094587 | Use of noble metals in the formation of conductive connectors | Christopher J. Jezewski, Srijit Mukherjee, Daniel Bergstrom, Tejaswi K. Indukuri, Flavio Griggio +1 more | 2021-08-17 |
| 10832951 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke | 2020-11-10 |
| 10700007 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, Tejaswi K. Indukuri, Colin T. Carver | 2020-06-30 |
| 10629525 | Seam healing of metal interconnects | Christopher J. Jezewski, Tejaswi K. Indukuri, James S. Clarke, John J. Plombon | 2020-04-21 |
| 10553477 | Forming interconnects with self-assembled monolayers | Aranzazu MAESTRE CARO | 2020-02-04 |
| 10068845 | Seam healing of metal interconnects | Christopher J. Jezewski, Tejaswi K. Indukuri, James S. Clarke, John J. Plombon | 2018-09-04 |
| 9997457 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, Tejaswi K. Indukuri, Colin T. Carver | 2018-06-12 |
| 9691657 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke | 2017-06-27 |
| 9391019 | Scalable interconnect structures with selective via posts | Mauro J. Kobrinsky, Tatyana N. Andryushchenko, Hui Jae Yoo | 2016-07-12 |
| 9385085 | Interconnects with fully clad lines | Manish Chandhok, Hui Jae Yoo, Christopher J. Jezewski, Colin T. Carver | 2016-07-05 |
| 9349636 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Tejaswi K. Indukuri, James S. Clarke | 2016-05-24 |
| 9165824 | Interconnects with fully clad lines | Manish Chandhok, Hui Jae Yoo, Christopher J. Jezewski, Colin T. Carver | 2015-10-20 |
| 8519510 | Semiconductor structure having an integrated quadruple-wall capacitor for embedded dynamic random access memory (eDRAM) and method to form the same | Brian S. Doyle, Uday Shah, Satyarth Suri | 2013-08-27 |