| 12108688 |
Forming semiconductor-superconductor hybrid devices with a horizontally-confined channel |
Geoffrey Charles Gardner, Sergei V. Gronin, Raymond Leonard Kallaher, Noah Seth Clay, Michael James Manfra |
2024-10-01 |
| 11849639 |
Forming semiconductor-superconductor hybrid devices with a horizontally-confined channel |
Geoffrey Charles Gardner, Sergei V. Gronin, Raymond Leonard Kallaher, Noah Seth Clay, Michael James Manfra |
2023-12-19 |
| 11749560 |
Cladded metal interconnects |
Thomas Marieb, Zhiyong Ma, Miriam Reshotko, Christopher J. Jezewski, Rahim Kasim +1 more |
2023-09-05 |
| 11652067 |
Methods of forming substrate interconnect structures for enhanced thin seed conduction |
Christopher J. Jezewski, Radek P. Chalupa, Inane Meric, Jiun-Chan Yang |
2023-05-16 |
| 11270943 |
Copper interconnect cladding |
Philip Yashar, Anthony V. Mule, Gopinath Trichy, Gokul Malyavanatham |
2022-03-08 |
| 11094587 |
Use of noble metals in the formation of conductive connectors |
Christopher J. Jezewski, Srijit Mukherjee, Daniel Bergstrom, Tejaswi K. Indukuri, Ramanan V. Chebiam +1 more |
2021-08-17 |
| 11018054 |
Integrated circuit interconnects |
Daniel J. Zierath, John D. Brooks |
2021-05-25 |
| 10903114 |
Decoupled via fill |
Yuriy V. Shusterman, Tejaswi K. Indukuri, Ruth A. Brain |
2021-01-26 |
| 10468298 |
Decoupled via fill |
Yuriy V. Shusterman, Tejaswi K. Indukuri, Ruth A. Brain |
2019-11-05 |
| 10211098 |
Decoupled via fill |
Yuriy V. Shusterman, Tejaswi K. Indukuri, Ruth A. Brain |
2019-02-19 |
| 10026649 |
Decoupled via fill |
Yuriy V. Shusterman, Tejaswi K. Indukuri, Ruth A. Brain |
2018-07-17 |
