| 12354956 |
Cobalt based interconnects and methods of fabrication thereof |
Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver |
2025-07-08 |
| 12266568 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke |
2025-04-01 |
| 11881432 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke |
2024-01-23 |
| 11862563 |
Cobalt based interconnects and methods of fabrication thereof |
Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver |
2024-01-02 |
| 11569126 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke |
2023-01-31 |
| 11328993 |
Cobalt based interconnects and methods of fabrication thereof |
Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver |
2022-05-10 |
| 11094587 |
Use of noble metals in the formation of conductive connectors |
Christopher J. Jezewski, Srijit Mukherjee, Daniel Bergstrom, Flavio Griggio, Ramanan V. Chebiam +1 more |
2021-08-17 |
| 10903114 |
Decoupled via fill |
Yuriy V. Shusterman, Flavio Griggio, Ruth A. Brain |
2021-01-26 |
| 10832951 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke |
2020-11-10 |
| 10700007 |
Cobalt based interconnects and methods of fabrication thereof |
Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver |
2020-06-30 |
| 10658586 |
RRAM devices and their methods of fabrication |
James S. Clarke, Ravi Pillarisetty, Uday Shah, Niloy Mukherjee, Elijah V. Karpov +1 more |
2020-05-19 |
| 10629525 |
Seam healing of metal interconnects |
Ramanan V. Chebiam, Christopher J. Jezewski, James S. Clarke, John J. Plombon |
2020-04-21 |
| 10580975 |
Spin transfer torque memory (STTM), methods of forming the same using volatile compound forming elements, and devices including the same |
Mark L. Doczy, Brian S. Doyle, Charles C. Kuo, Kaan Oguz, Kevin P. O'Brien +1 more |
2020-03-03 |
| 10468298 |
Decoupled via fill |
Yuriy V. Shusterman, Flavio Griggio, Ruth A. Brain |
2019-11-05 |
| 10381556 |
Spin transfer torque memory (STTM), methods of forming the same using a non-conformal insulator, and devices including the same |
Mark L. Doczy, Brian S. Doyle, Charles C. Kuo, Kaan Oguz, Kevin P. O'Brien +1 more |
2019-08-13 |
| 10211098 |
Decoupled via fill |
Yuriy V. Shusterman, Flavio Griggio, Ruth A. Brain |
2019-02-19 |
| 10068845 |
Seam healing of metal interconnects |
Ramanan V. Chebiam, Christopher J. Jezewski, James S. Clarke, John J. Plombon |
2018-09-04 |
| 10026649 |
Decoupled via fill |
Yuriy V. Shusterman, Flavio Griggio, Ruth A. Brain |
2018-07-17 |
| 9997457 |
Cobalt based interconnects and methods of fabrication thereof |
Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver |
2018-06-12 |
| 9691657 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke |
2017-06-27 |
| 9659869 |
Forming barrier walls, capping, or alloys /compounds within metal lines |
Christopher J. Jezewski, Alan M Meyers, Kanwal Jit Singh, James S. Clarke, Florian Gstrein |
2017-05-23 |
| 9514983 |
Cobalt based interconnects and methods of fabrication thereof |
Christopher J. Jezewski, James S. Clarke, Florian Gstrein, Daniel J. Zierath |
2016-12-06 |
| 9349636 |
Interconnect wires including relatively low resistivity cores |
Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke |
2016-05-24 |
| 7867891 |
Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance |
Kevin P. O'Brien, Rohan Akolkar, Arnel M. Fajardo |
2011-01-11 |