Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354956 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver | 2025-07-08 |
| 12266568 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke | 2025-04-01 |
| 11881432 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke | 2024-01-23 |
| 11862563 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver | 2024-01-02 |
| 11569126 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke | 2023-01-31 |
| 11328993 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver | 2022-05-10 |
| 11094587 | Use of noble metals in the formation of conductive connectors | Christopher J. Jezewski, Srijit Mukherjee, Daniel Bergstrom, Flavio Griggio, Ramanan V. Chebiam +1 more | 2021-08-17 |
| 10903114 | Decoupled via fill | Yuriy V. Shusterman, Flavio Griggio, Ruth A. Brain | 2021-01-26 |
| 10832951 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke | 2020-11-10 |
| 10700007 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver | 2020-06-30 |
| 10658586 | RRAM devices and their methods of fabrication | James S. Clarke, Ravi Pillarisetty, Uday Shah, Niloy Mukherjee, Elijah V. Karpov +1 more | 2020-05-19 |
| 10629525 | Seam healing of metal interconnects | Ramanan V. Chebiam, Christopher J. Jezewski, James S. Clarke, John J. Plombon | 2020-04-21 |
| 10580975 | Spin transfer torque memory (STTM), methods of forming the same using volatile compound forming elements, and devices including the same | Mark L. Doczy, Brian S. Doyle, Charles C. Kuo, Kaan Oguz, Kevin P. O'Brien +1 more | 2020-03-03 |
| 10468298 | Decoupled via fill | Yuriy V. Shusterman, Flavio Griggio, Ruth A. Brain | 2019-11-05 |
| 10381556 | Spin transfer torque memory (STTM), methods of forming the same using a non-conformal insulator, and devices including the same | Mark L. Doczy, Brian S. Doyle, Charles C. Kuo, Kaan Oguz, Kevin P. O'Brien +1 more | 2019-08-13 |
| 10211098 | Decoupled via fill | Yuriy V. Shusterman, Flavio Griggio, Ruth A. Brain | 2019-02-19 |
| 10068845 | Seam healing of metal interconnects | Ramanan V. Chebiam, Christopher J. Jezewski, James S. Clarke, John J. Plombon | 2018-09-04 |
| 10026649 | Decoupled via fill | Yuriy V. Shusterman, Flavio Griggio, Ruth A. Brain | 2018-07-17 |
| 9997457 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver | 2018-06-12 |
| 9691657 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke | 2017-06-27 |
| 9659869 | Forming barrier walls, capping, or alloys /compounds within metal lines | Christopher J. Jezewski, Alan M Meyers, Kanwal Jit Singh, James S. Clarke, Florian Gstrein | 2017-05-23 |
| 9514983 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, James S. Clarke, Florian Gstrein, Daniel J. Zierath | 2016-12-06 |
| 9349636 | Interconnect wires including relatively low resistivity cores | Hui Jae Yoo, Ramanan V. Chebiam, James S. Clarke | 2016-05-24 |
| 7867891 | Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance | Kevin P. O'Brien, Rohan Akolkar, Arnel M. Fajardo | 2011-01-11 |