Issued Patents All Time
Showing 25 most recent of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406956 | Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers | Abhishek A. Sharma, Van H. Le, Kimin Jun, Wilfred Gomes | 2025-09-02 |
| 12396155 | Backend memory with air gaps in upper metal layers | Abhishek A. Sharma, Albert Chen, Wilfred Gomes, Fatih Hamzaoglu, Travis W. Lajoie +3 more | 2025-08-19 |
| 12376342 | Passivation layers for thin film transistors | Abhishek A. Sharma, Arnab Sen Gupta, Travis W. Lajoie, Sarah Atanasov, Chieh-Jen Ku +5 more | 2025-07-29 |
| 12310032 | Stacked backend memory with resistive switching devices | Wilfred Gomes, Abhishek A. Sharma, Van H. Le | 2025-05-20 |
| 12300537 | Conformal low temperature hermetic dielectric diffusion barriers | Sean King, Sreenivas Kosaraju, Timothy E. Glassman | 2025-05-13 |
| 12266568 | Interconnect wires including relatively low resistivity cores | Tejaswi K. Indukuri, Ramanan V. Chebiam, James S. Clarke | 2025-04-01 |
| 12255137 | Sideways vias in isolation areas to contact interior layers in stacked devices | Ehren Mannebach, Aaron D. Lilak, Patrick Morrow, Anh Phan, Willy Rachmady +3 more | 2025-03-18 |
| 12224202 | Forming an oxide volume within a fin | Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron D. Lilak, Ehren Mannebach +3 more | 2025-02-11 |
| 12150297 | Thin film transistors having a backside channel contact for high density memory | Noriyuki Sato, Sarah Atanasov, Abhishek A. Sharma, Bernhard Sell, Chieh-Jen Ku +6 more | 2024-11-19 |
| 12148806 | Stacked source-drain-gate connection and process for forming such | Ehren Mannebach, Aaron D. Lilak, Patrick Morrow, Anh Phan, Willy Rachmady +2 more | 2024-11-19 |
| 12148734 | Transistors, memory cells, and arrangements thereof | Sarah Atanasov, Abhishek A. Sharma, Bernhard Sell, Chieh-Jen Ku, Elliot N. Tan +4 more | 2024-11-19 |
| 12080605 | Backside contacts for semiconductor devices | Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +4 more | 2024-09-03 |
| 12080781 | Fabrication of thin film fin transistor structure | Noriyuki Sato, Sarah Atanasov, Abhishek A. Sharma, Bernhard Sell, Chieh-Jen Ku +6 more | 2024-09-03 |
| 12040226 | Conformal low temperature hermetic dielectric diffusion barriers | Sean King, Sreenivas Kosaraju, Timothy E. Glassman | 2024-07-16 |
| 12027458 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2024-07-02 |
| 12020929 | Epitaxial layer with substantially parallel sides | Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron D. Lilak, Ehren Mannebach +3 more | 2024-06-25 |
| 12002754 | Multi-height and multi-width interconnect line metallization for integrated circuit structures | Kevin Lin | 2024-06-04 |
| 11996411 | Stacked forksheet transistors | Cheng-Ying Huang, Gilbert Dewey, Anh Phan, Nicole K. Thomas, Urusa Alaan +8 more | 2024-05-28 |
| 11955560 | Passivation layers for thin film transistors and methods of fabrication | Abhishek A. Sharma, Arnab Sen Gupta, Travis W. Lajoie, Sarah Atanasov, Chieh-Jen Ku +5 more | 2024-04-09 |
| 11942416 | Sideways vias in isolation areas to contact interior layers in stacked devices | Ehren Mannebach, Aaron D. Lilak, Patrick Morrow, Anh Phan, Willy Rachmady +3 more | 2024-03-26 |
| 11916118 | Stacked source-drain-gate connection and process for forming such | Ehren Mannebach, Aaron D. Lilak, Patrick Morrow, Anh Phan, Willy Rachmady +2 more | 2024-02-27 |
| 11881432 | Interconnect wires including relatively low resistivity cores | Tejaswi K. Indukuri, Ramanan V. Chebiam, James S. Clarke | 2024-01-23 |
| 11869894 | Metallization structures for stacked device connectivity and their methods of fabrication | Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more | 2024-01-09 |
| 11812599 | Compute near memory with backend memory | Abhishek A. Sharma, Noriyuki Sato, Sarah Atanasov, Huseyin Ekin Sumbul, Gregory K. Chen +3 more | 2023-11-07 |
| 11798838 | Capacitance reduction for semiconductor devices based on wafer bonding | Ehren Mannebach, Aaron D. Lilak, Rishabh Mehandru, Patrick Morrow, Kevin Lin | 2023-10-24 |