Issued Patents All Time
Showing 51–74 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11251076 | Conformal low temperature hermetic dielectric diffusion barriers | Sean King, Sreenivas Kosaraju, Timothy E. Glassman | 2022-02-15 |
| 11251186 | Compute near memory with backend memory | Abhishek A. Sharma, Noriyuki Sato, Sarah Atanasov, Huseyin Ekin Sumbul, Gregory K. Chen +3 more | 2022-02-15 |
| 11152254 | Pitch quartered three-dimensional air gaps | Manish Chandhok, Sudipto Naskar, Stephanie A. Bojarski, Kevin Lin, Marie Krysak +3 more | 2021-10-19 |
| 10971394 | Maskless air gap to prevent via punch through | Manish Chandhok, Todd R. Younkin, Eungnak Han, Jasmeet S. Chawla, Marie Krysak +1 more | 2021-04-06 |
| 10832951 | Interconnect wires including relatively low resistivity cores | Tejaswi K. Indukuri, Ramanan V. Chebiam, James S. Clarke | 2020-11-10 |
| 10763161 | Conformal low temperature hermetic dielectric diffusion barriers | Sean King, Sreenivas Kosaraju, Timothy E. Glassman | 2020-09-01 |
| 10546772 | Self-aligned via below subtractively patterned interconnect | Manish Chandhok, Richard E. Schenker, Kevin Lin, Jasmeet S. Chawla, Stephanie A. Bojarski +3 more | 2020-01-28 |
| 10529619 | Conformal low temperature hermetic dielectric diffusion barriers | Sean King, Sreenivas Kosaraju, Timothy E. Glassman | 2020-01-07 |
| 10438844 | Conformal low temperature hermetic dielectric diffusion barriers | Sean King, Sreenivas Kosaraju, Timothy E. Glassman | 2019-10-08 |
| 10256141 | Maskless air gap to prevent via punch through | Manish Chandhok, Todd R. Younkin, Eungnak Han, Jasmeet S. Chawla, Marie Krysak +1 more | 2019-04-09 |
| 9935002 | Conformal low temperature hermetic dielectric diffusion barriers | Sean King, Sreenivas Kosaraju, Timothy E. Glassman | 2018-04-03 |
| 9793163 | Subtractive self-aligned via and plug patterning for back end of line (BEOL) interconnects | Robert L. Bristol, Florian Gstrein, Richard E. Schenker, Paul A. Nyhus, Charles H. Wallace | 2017-10-17 |
| 9754821 | Conformal low temperature hermetic dielectric diffusion barriers | Sean King, Sreenivas Kosaraju, Timothy E. Glassman | 2017-09-05 |
| 9691657 | Interconnect wires including relatively low resistivity cores | Tejaswi K. Indukuri, Ramanan V. Chebiam, James S. Clarke | 2017-06-27 |
| 9391019 | Scalable interconnect structures with selective via posts | Mauro J. Kobrinsky, Tatyana N. Andryushchenko, Ramanan V. Chebiam | 2016-07-12 |
| 9385085 | Interconnects with fully clad lines | Manish Chandhok, Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver | 2016-07-05 |
| 9349636 | Interconnect wires including relatively low resistivity cores | Tejaswi K. Indukuri, Ramanan V. Chebiam, James S. Clarke | 2016-05-24 |
| 9330963 | Conformal low temperature hermetic dielectric diffusion barriers | Sean King, Sreenivas Kosaraju, Timothy E. Glassman | 2016-05-03 |
| 9324652 | Method of creating a maskless air gap in back end interconnections with double self-aligned vias | Manish Chandhok, Yan Borodovsky, Florian Gstrein, David Shykind, Kevin Lin | 2016-04-26 |
| 9165824 | Interconnects with fully clad lines | Manish Chandhok, Christopher J. Jezewski, Ramanan V. Chebiam, Colin T. Carver | 2015-10-20 |
| 8975138 | Method of creating a maskless air gap in back end interconnects with double self-aligned vias | Manish Chandhok, Yan Borodovsky, Florian Gstrein, David Shykind, Kevin Lin | 2015-03-10 |
| 8524597 | Methods for forming planarized hermetic barrier layers and structures formed thereby | Sean King | 2013-09-03 |
| 8461683 | Self-forming, self-aligned barriers for back-end interconnects and methods of making same | Jeffery D. Bielefeld, Sean King, Sridhar Balakrishnan | 2013-06-11 |
| 8039920 | Methods for forming planarized hermetic barrier layers and structures formed thereby | Sean King | 2011-10-18 |