| 11201129 |
Designs and methods for conductive bumps |
Valery M. Dubin, Mark Bohr |
2021-12-14 |
$41,312,000 |
| 10249588 |
Designs and methods for conductive bumps |
Valery M. Dubin, Mark Bohr |
2019-04-02 |
$26,887,000 |
| 9543261 |
Designs and methods for conductive bumps |
Valery M. Dubin, Mark Bohr |
2017-01-10 |
$11,357,000 |
| 9461010 |
Debond interconnect structures |
Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Satish Radhakrishnan +2 more |
2016-10-04 |
$11,494,000 |
| 9269686 |
Debond interconnect structures |
Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Satish Radhakrishnan +2 more |
2016-02-23 |
$10,383,000 |
| 8637778 |
Debond interconnect structures |
Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Satish Radhakrishnan +2 more |
2014-01-28 |
$20,482,000 |
| 8580679 |
Designs and methods for conductive bumps |
Valery M. Dubin, Mark Bohr |
2013-11-12 |
$15,654,000 |
| 8508018 |
Barrier layers |
Rohan Akolkar, James S. Clarke, Christopher J. Jezewski, Philip Yashar |
2013-08-13 |
$12,122,000 |
| 8461683 |
Self-forming, self-aligned barriers for back-end interconnects and methods of making same |
Hui Jae Yoo, Jeffery D. Bielefeld, Sean King |
2013-06-11 |
$12,060,000 |
| 7772706 |
Air-gap ILD with unlanded vias |
Boyan Boyanov |
2010-08-10 |
$11,211,000 |
| 7629252 |
Conformal electroless deposition of barrier layer materials |
Kevin P. O'Brien, Chin-Chang Cheng, Ramanan V. Chebiam, Valery M. Dubin |
2009-12-08 |
$15,228,000 |
| 7335587 |
Post polish anneal of atomic layer deposition barrier layers |
Steven W. Johnston, Kevin P. O'Brien |
2008-02-26 |
$16,748,000 |
| 7276801 |
Designs and methods for conductive bumps |
Valery M. Dubin, Mark Bohr |
2007-10-02 |
$20,761,000 |
| 7081986 |
Method and system for controlling amplifier power in an optical communications network having add/drop capability |
James E. DeGrange, Jr. |
2006-07-25 |
$25,268,000 |
| 7054562 |
Method and system for suppressing ASE on a WDM network |
Vipul Bhatnagar |
2006-05-30 |
$6,263,000 |
| 6614589 |
Method and system for controlling amplifier power in an optical communications network |
James E. DeGrange, Jr. |
2003-09-02 |
$28,606,000 |
| 6600596 |
Method and system for controlling amplifier power in an optical communications network having add/drop capability |
James E. DeGrange, Jr. |
2003-07-29 |
$25,880,000 |
| 6559985 |
Method and system for determining channel power in an optical communications network |
James E. DeGrange, Jr. |
2003-05-06 |
$48,005,000 |
| 6461954 |
Method and an apparatus for forming an under bump metallization structure |
Jian Li, Xiao-Chun Mu |
2002-10-08 |
$34,377,000 |
| 6312830 |
Method and an apparatus for forming an under bump metallization structure |
Jian Li, Xiao-Chun Mu |
2001-11-06 |
$210,286,000 |
| 6054376 |
Method of sealing a semiconductor substrate |
— |
2000-04-25 |
$208,912,000 |
| 5164330 |
Etchback process for tungsten utilizing a NF3/AR chemistry |
Rickie L. Davis, Sohail Ahmed |
1992-11-17 |
$57,569,000 |
