Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461010 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan +2 more | 2016-10-04 |
| 9269686 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan +2 more | 2016-02-23 |
| 8637778 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan +2 more | 2014-01-28 |