Issued Patents All Time
Showing 25 most recent of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12350231 | Massager | Lang Cun, Xuefei Cai | 2025-07-08 |
| 12186257 | Massager | Lang Cun, Xuefei Cai | 2025-01-07 |
| 10552507 | Application interface update method, apparatus and system | Wenxuan Jia, Junyao Chen, Baoxiang Ma, Shupeng Wang | 2020-02-04 |
| 10508961 | Semiconductor package with air pressure sensor | Kevin Lin, Feras Eid, Johanna M. Swan, Weng Hong Teh | 2019-12-17 |
| 10453635 | Package MEMS switch and method | Johanna M. Swan, Valluri Rao, Feras Eid | 2019-10-22 |
| 10156583 | Method of making an accelerometer | Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more | 2018-12-18 |
| 10070524 | Method of making glass core substrate for integrated circuit devices | Quan Tran, Robert L. Sankman, Johanna M. Swan, Valluri Rao | 2018-09-04 |
| 10008452 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Johanna M. Swan, Robert Starkston, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov | 2018-06-26 |
| 9793201 | Glass clad microelectronic substrate | Johanna M. Swan | 2017-10-17 |
| 9761514 | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | Chuan Hu, Patrick Morrow | 2017-09-12 |
| 9691579 | Package MEMS switch and method | Johanna M. Swan, Valluri Rao, Feras Eid | 2017-06-27 |
| 9686861 | Glass core substrate for integrated circuit devices and methods of making the same | Quan Tran, Robert L. Sankman, Johanna M. Swan, Valluri Rao | 2017-06-20 |
| 9674945 | Heterogeneous integration of microfluidic devices in package structures | Weng Hong Teh, Kevin Lin, Feras Eid | 2017-06-06 |
| 9673131 | Integrated circuit package assemblies including a glass solder mask layer | Chuan Hu, Chia-Pin Chiu | 2017-06-06 |
| 9642248 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Johanna M. Swan, Robert Starkston, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov | 2017-05-02 |
| 9617148 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Johanna M. Swan, Min Tao, Charles A. Gealer, Edward Zarbock | 2017-04-11 |
| 9461010 | Debond interconnect structures | Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-10-04 |
| 9445496 | Glass clad microelectronic substrate | Johanna M. Swan | 2016-09-13 |
| 9429427 | Inductive inertial sensor architecture and fabrication in packaging build-up layers | Feras Eid, Kevin Lin, Johanna M. Swan, Weng Hong Teh, Valluri Rao | 2016-08-30 |
| 9420707 | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | Chuan Hu, Patrick Morrow | 2016-08-16 |
| 9368429 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Johanna M. Swan, Min Tao, Charles A. Gealer, Edward A. Zarbock | 2016-06-14 |
| 9297824 | Techniques, systems and devices related to acceleration measurement | Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more | 2016-03-29 |
| 9267944 | Biosensor utilizing a resonator having a functionalized surface | Yuegang Zhang, Andrew Berlin, Li-Peng Wang, Valluri Rao, Mineo Yamakawa | 2016-02-23 |
| 9269686 | Debond interconnect structures | Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-02-23 |
| 9250261 | Method, apparatus and system for providing metering of acceleration | Kevin Lin, Feras Eid | 2016-02-02 |