| 12350231 |
Massager |
Lang Cun, Xuefei Cai |
2025-07-08 |
|
| 12186257 |
Massager |
Lang Cun, Xuefei Cai |
2025-01-07 |
|
| 10552507 |
Application interface update method, apparatus and system |
Wenxuan Jia, Junyao Chen, Baoxiang Ma, Shupeng Wang |
2020-02-04 |
|
| 10508961 |
Semiconductor package with air pressure sensor |
Kevin Lin, Feras Eid, Johanna M. Swan, Weng Hong Teh |
2019-12-17 |
$31,829,000 |
| 10453635 |
Package MEMS switch and method |
Johanna M. Swan, Valluri Rao, Feras Eid |
2019-10-22 |
$16,310,000 |
| 10156583 |
Method of making an accelerometer |
Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more |
2018-12-18 |
$25,622,000 |
| 10070524 |
Method of making glass core substrate for integrated circuit devices |
Quan Tran, Robert L. Sankman, Johanna M. Swan, Valluri Rao |
2018-09-04 |
$19,235,000 |
| 10008452 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Johanna M. Swan, Robert Starkston, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov |
2018-06-26 |
$24,418,000 |
| 9793201 |
Glass clad microelectronic substrate |
Johanna M. Swan |
2017-10-17 |
$9,876,000 |
| 9761514 |
Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
Chuan Hu, Patrick Morrow |
2017-09-12 |
$10,213,000 |
| 9691579 |
Package MEMS switch and method |
Johanna M. Swan, Valluri Rao, Feras Eid |
2017-06-27 |
$7,334,000 |
| 9686861 |
Glass core substrate for integrated circuit devices and methods of making the same |
Quan Tran, Robert L. Sankman, Johanna M. Swan, Valluri Rao |
2017-06-20 |
$9,273,000 |
| 9674945 |
Heterogeneous integration of microfluidic devices in package structures |
Weng Hong Teh, Kevin Lin, Feras Eid |
2017-06-06 |
$12,588,000 |
| 9673131 |
Integrated circuit package assemblies including a glass solder mask layer |
Chuan Hu, Chia-Pin Chiu |
2017-06-06 |
$12,588,000 |
| 9642248 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Johanna M. Swan, Robert Starkston, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov |
2017-05-02 |
$12,076,000 |
| 9617148 |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips |
Johanna M. Swan, Min Tao, Charles A. Gealer, Edward Zarbock |
2017-04-11 |
$8,965,000 |
| 9461010 |
Debond interconnect structures |
Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more |
2016-10-04 |
$11,494,000 |
| 9445496 |
Glass clad microelectronic substrate |
Johanna M. Swan |
2016-09-13 |
$11,798,000 |
| 9429427 |
Inductive inertial sensor architecture and fabrication in packaging build-up layers |
Feras Eid, Kevin Lin, Johanna M. Swan, Weng Hong Teh, Valluri Rao |
2016-08-30 |
$15,019,000 |
| 9420707 |
Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
Chuan Hu, Patrick Morrow |
2016-08-16 |
$10,311,000 |
| 9368429 |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips |
Johanna M. Swan, Min Tao, Charles A. Gealer, Edward A. Zarbock |
2016-06-14 |
$9,885,000 |
| 9297824 |
Techniques, systems and devices related to acceleration measurement |
Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more |
2016-03-29 |
$14,056,000 |
| 9269686 |
Debond interconnect structures |
Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more |
2016-02-23 |
$10,383,000 |
| 9267944 |
Biosensor utilizing a resonator having a functionalized surface |
Yuegang Zhang, Andrew Berlin, Li-Peng Wang, Valluri Rao, Mineo Yamakawa |
2016-02-23 |
$10,383,000 |
| 9250261 |
Method, apparatus and system for providing metering of acceleration |
Kevin Lin, Feras Eid |
2016-02-02 |
$9,951,000 |
