| 9570883 |
Photonic package architecture |
Debendra Mallik |
2017-02-14 |
| 9368429 |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips |
Qing Ma, Johanna M. Swan, Min Tao, Charles A. Gealer |
2016-06-14 |
| 9190388 |
Using an optically transparent solid material as a support structure for attachment of a semiconductor material to a substrate |
Robert L. Sankman |
2015-11-17 |
| 8004076 |
Microelectronic package with carbon nanotubes interconnect and method of making same |
Gloria Alejandra Camacho Bragado |
2011-08-23 |
| 7629203 |
Thermal interface material for combined reflow |
Daewoong Suh, Sabina J. Houle |
2009-12-08 |
| 7588968 |
Linked chip attach and underfill |
Ming Lei, Sabina J. Houle |
2009-09-15 |
| 7373033 |
Chip-to-chip optical interconnect |
Daoqiang Lu, Jiamiao Tang, Jiangqi He |
2008-05-13 |
| 6924551 |
Through silicon via, folded flex microelectronic package |
Christopher L. Rumer |
2005-08-02 |
| 6376007 |
Method of marking glass |
Charles A. Rowell, David W. Jacobs |
2002-04-23 |
