Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199082 | Method of direct-bonded optoelectronic devices | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2025-01-14 |
| 12166024 | Direct-bonded LED arrays drivers | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2024-12-10 |
| 12124035 | Stretchable film assembly with conductive traces | Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara | 2024-10-22 |
| 11715730 | Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2023-08-01 |
| 11329034 | Direct-bonded LED structure contacts and substrate contacts | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2022-05-10 |
| 11246230 | Configurable smart object system with methods of making modules and contactors | Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara | 2022-02-08 |
| 11239587 | Configurable smart object system with clip-based connectors | Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara | 2022-02-01 |
| 11221513 | Electronic device display with a backlight | Supriya Goyal, Yuxi Zhao, Xinsheng Chu, Chan Hyuk Park, Wenyong Zhu | 2022-01-11 |
| 10955671 | Stretchable film assembly with conductive traces | Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara | 2021-03-23 |
| 10782485 | Hardened fiber optic connectors having a mechanical splice connector assembly | Michael de Jong, Wolf Peter Kluwe, Daniel Leyva, Jr. | 2020-09-22 |
| 10734759 | Configurable smart object system with magnetic contacts and magnetic assembly | Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara | 2020-08-04 |
| 10629577 | Direct-bonded LED arrays and applications | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2020-04-21 |
| 10354976 | Dies-on-package devices and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2019-07-16 |
| 10354945 | Multi-surface edge pads for vertical mount packages and methods of making package stacks | Rajesh Katkar, Javier A. Delacruz, Hoki Kim, Akash Agrawal | 2019-07-16 |
| 10151887 | Hardened fiber optic connectors having a mechanical splice connector assembly | Michael de Jong, Wolf Peter Kluwe, Daniel Leyva, Jr. | 2018-12-11 |
| 9991233 | Package-on-package devices with same level WLP components and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-06-05 |
| 9991235 | Package on-package devices with upper RDL of WLPS and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-06-05 |
| 9985007 | Package on-package devices with multiple levels and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-29 |
| 9972609 | Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-15 |
| 9972573 | Wafer-level packaged components and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-15 |
| 9728524 | Enhanced density assembly having microelectronic packages mounted at substantial angle to board | Zhuowen Sun, Hoki Kim, Wael Zohni, Akash Agrawal | 2017-08-08 |
| 9691728 | BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility | Robert M. Nickerson, John S. Guzek | 2017-06-27 |
| 9617148 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Qing Ma, Johanna M. Swan, Charles A. Gealer, Edward Zarbock | 2017-04-11 |
| 9368429 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Qing Ma, Johanna M. Swan, Charles A. Gealer, Edward A. Zarbock | 2016-06-14 |