Issued Patents All Time
Showing 1–25 of 147 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255153 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Ashok S. Prabhu, Willmar Subido | 2025-03-18 |
| 12112440 | Mixed-reality visor for in-situ vehicular operations training | — | 2024-10-08 |
| 11810867 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Ashok S. Prabhu, Willmar Subido | 2023-11-07 |
| 11462483 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Ashok S. Prabhu, Willmar Subido | 2022-10-04 |
| 10806036 | Pressing of wire bond wire tips to provide bent-over tips | Reynaldo Co, Grant Villavicencio | 2020-10-13 |
| 10790222 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Belgacem Haba, Liang Wang, Akash Agrawal | 2020-09-29 |
| 10692842 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2020-06-23 |
| 10643977 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2020-05-05 |
| 10622289 | Stacked chip-on-board module with edge connector | Belgacem Haba | 2020-04-14 |
| 10559537 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Ashok S. Prabhu, Willmar Subido | 2020-02-11 |
| 10490528 | Embedded wire bond wires | Ashok S. Prabhu, Abiola Awujoola, Willmar Subido | 2019-11-26 |
| 10354976 | Dies-on-package devices and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2019-07-16 |
| 10283445 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Belgacem Haba, Liang Wang, Akash Agrawal | 2019-05-07 |
| 10211160 | Microelectronic assembly with redistribution structure formed on carrier | Belgacem Haba, Cyprian Emeka Uzoh | 2019-02-19 |
| 10115678 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Ashok S. Prabhu, Willmar Subido | 2018-10-30 |
| 10090280 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2018-10-02 |
| 10032752 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2018-07-24 |
| 10008477 | Microelectronic element with bond elements to encapsulation surface | Belgacem Haba, Richard Dewitt Crisp | 2018-06-26 |
| 9991235 | Package on-package devices with upper RDL of WLPS and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2018-06-05 |
| 9991233 | Package-on-package devices with same level WLP components and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2018-06-05 |
| 9985007 | Package on-package devices with multiple levels and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2018-05-29 |
| 9972609 | Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2018-05-15 |
| 9972573 | Wafer-level packaged components and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2018-05-15 |
| 9947641 | Wire bond support structure and microelectronic package including wire bonds therefrom | Reynaldo Co, Rizza Lee Saga Cizek, Rajesh Katkar | 2018-04-17 |
| 9928883 | TFD I/O partition for high-speed, high-density applications | Zhuowen Sun, Kyong-Mo Bang, Belgacem Haba | 2018-03-27 |