Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10806036 | Pressing of wire bond wire tips to provide bent-over tips | Reynaldo Co, Wael Zohni | 2020-10-13 |
| 9888579 | Pressing of wire bond wire tips to provide bent-over tips | Reynaldo Co, Wael Zohni | 2018-02-06 |
| 9659848 | Stiffened wires for offset BVA | Sangil Lee, Roseann Alatorre, Javier A. Delacruz, Scott McGrath | 2017-05-23 |
| 9508689 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Reynaldo Co, Jeffrey S. Leal, Suzette K. Pangrle, Scott McGrath, De Ann Eileen Melcher +3 more | 2016-11-29 |
| 9153517 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Reynaldo Co, Jeffrey S. Leal, Suzette K. Pangrle, Scott McGrath, DeAnn Eileen Melcher +3 more | 2015-10-06 |
| 8884403 | Semiconductor die array structure | Reynaldo Co, DeAnn Eileen Melcher, Weiping Pan | 2014-11-11 |
| 8829677 | Semiconductor die having fine pitch electrical interconnects | Keith L. Barrie, Suzette K. Pangrie, Jeffrey S. Leal | 2014-09-09 |
| 8680687 | Electrical interconnect for die stacked in zig-zag configuration | Reynaldo Co, Jeffrey S. Leal, Simon J. S. McElrea | 2014-03-25 |
| 8324081 | Wafer level surface passivation of stackable integrated circuit chips | Simon J. S. McElrea, Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Reynaldo Co +5 more | 2012-12-04 |
| 7923349 | Wafer level surface passivation of stackable integrated circuit chips | Simon J. S. McElrea, Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Reynaldo Co +5 more | 2011-04-12 |
| 7863159 | Semiconductor die separation method | Reynaldo Co, DeAnn Eileen Melcher, Weiping Pan | 2011-01-04 |