Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9153517 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Reynaldo Co, Jeffrey S. Leal, Suzette K. Pangrle, Scott McGrath, Keith L. Barrie +3 more | 2015-10-06 |
| 8884403 | Semiconductor die array structure | Reynaldo Co, Weiping Pan, Grant Villavicencio | 2014-11-11 |
| 8704379 | Semiconductor die mount by conformal die coating | Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, Marc E. Robinson | 2014-04-22 |
| 8324081 | Wafer level surface passivation of stackable integrated circuit chips | Simon J. S. McElrea, Terrence Caskey, Scott McGrath, Reynaldo Co, Lawrence Douglas Andrews, JR. +5 more | 2012-12-04 |
| 7923349 | Wafer level surface passivation of stackable integrated circuit chips | Simon J. S. McElrea, Terrence Caskey, Scott McGrath, Reynaldo Co, Lawrence Douglas Andrews, JR. +5 more | 2011-04-12 |
| 7863159 | Semiconductor die separation method | Reynaldo Co, Weiping Pan, Grant Villavicencio | 2011-01-04 |