| 9153517 |
Electrical connector between die pad and z-interconnect for stacked die assemblies |
Reynaldo Co, Jeffrey S. Leal, Suzette K. Pangrle, Scott McGrath, Keith L. Barrie +3 more |
2015-10-06 |
| 8884403 |
Semiconductor die array structure |
Reynaldo Co, Weiping Pan, Grant Villavicencio |
2014-11-11 |
| 8704379 |
Semiconductor die mount by conformal die coating |
Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, Marc E. Robinson |
2014-04-22 |
| 8324081 |
Wafer level surface passivation of stackable integrated circuit chips |
Simon J. S. McElrea, Terrence Caskey, Scott McGrath, Reynaldo Co, Lawrence Douglas Andrews, JR. +5 more |
2012-12-04 |
| 7923349 |
Wafer level surface passivation of stackable integrated circuit chips |
Simon J. S. McElrea, Terrence Caskey, Scott McGrath, Reynaldo Co, Lawrence Douglas Andrews, JR. +5 more |
2011-04-12 |
| 7863159 |
Semiconductor die separation method |
Reynaldo Co, Weiping Pan, Grant Villavicencio |
2011-01-04 |