Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9305862 | Support mounted electrically interconnected die assembly | Simon J. S. McElrea, Marc E. Robinson | 2016-04-05 |
| 8742602 | Vertical electrical interconnect formed on support prior to die mount | Terrence Caskey, Scott McGrath, Simon J. S. McElrea, Yong Du, Mark A. Scott | 2014-06-03 |
| 8723332 | Electrically interconnected stacked die assemblies | Simon J. S. McElrea, Scott McGrath, Terrence Caskey, Scott Jay Crane, Marc E. Robinson +1 more | 2014-05-13 |
| 8629543 | Electrically interconnected stacked die assemblies | Simon J. S. McElrea, Scott McGrath, Terrence Caskey, Scott Jay Crane, Marc E. Robinson +1 more | 2014-01-14 |
| 8324081 | Wafer level surface passivation of stackable integrated circuit chips | Simon J. S. McElrea, Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Reynaldo Co +5 more | 2012-12-04 |
| 8178978 | Support mounted electrically interconnected die assembly | Simon J. S. McElrea, Marc E. Robinson | 2012-05-15 |
| 8159053 | Flat leadless packages and stacked leadless package assemblies | Jeffrey S. Leal, Simon J. S. McElrea | 2012-04-17 |
| 7923349 | Wafer level surface passivation of stackable integrated circuit chips | Simon J. S. McElrea, Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Reynaldo Co +5 more | 2011-04-12 |
| 7843046 | Flat leadless packages and stacked leadless package assemblies | Jeffrey S. Leal, Simon J. S. McElrea | 2010-11-30 |