Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211821 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2025-01-28 |
| 11735563 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2023-08-22 |
| 11189595 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2021-11-30 |
| 10806036 | Pressing of wire bond wire tips to provide bent-over tips | Grant Villavicencio, Wael Zohni | 2020-10-13 |
| 10756049 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2020-08-25 |
| 10297582 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman +3 more | 2019-05-21 |
| 9947641 | Wire bond support structure and microelectronic package including wire bonds therefrom | Wael Zohni, Rizza Lee Saga Cizek, Rajesh Katkar | 2018-04-17 |
| 9893033 | Off substrate kinking of bond wire | Belgacem Haba, Rizza Lee Saga Cizek, Wael Zohni | 2018-02-13 |
| 9888579 | Pressing of wire bond wire tips to provide bent-over tips | Grant Villavicencio, Wael Zohni | 2018-02-06 |
| 9825002 | Flipped die stack | Rajesh Katkar, Scott McGrath, Ashok S. Prabhu, Sangil Lee, Liang Wang +1 more | 2017-11-21 |
| 9761554 | Ball bonding metal wire bond wires to metal pads | Willmar Subido, Wael Zohni, Ashok S. Prabhu | 2017-09-12 |
| 9761558 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2017-09-12 |
| 9691679 | Method for package-on-package assembly with wire bonds to encapsulation surface | Laura Wills Mirkarimi | 2017-06-27 |
| 9615456 | Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Ilyas Mohammed, Terrence Caskey, Ellis Chau | 2017-04-04 |
| 9530749 | Coupling of side surface contacts to a circuit platform | Willmar Subido, Hoang Linh Nguyen, Marjorie Cara, Wael Zohni, Christopher W. Lattin | 2016-12-27 |
| 9508689 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Jeffrey S. Leal, Suzette K. Pangrle, Scott McGrath, De Ann Eileen Melcher, Keith L. Barrie +3 more | 2016-11-29 |
| 9502390 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman +3 more | 2016-11-22 |
| 9412714 | Wire bond support structure and microelectronic package including wire bonds therefrom | Wael Zohni, Rizza Lee Saga Cizek, Rajesh Katkar | 2016-08-09 |
| 9349706 | Method for package-on-package assembly with wire bonds to encapsulation surface | Laura Wills Mirkarimi | 2016-05-24 |
| 9252122 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2016-02-02 |
| 9153517 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Jeffrey S. Leal, Suzette K. Pangrle, Scott McGrath, DeAnn Eileen Melcher, Keith L. Barrie +3 more | 2015-10-06 |
| 9105483 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2015-08-11 |
| 9095074 | Structure for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Ilyas Mohammed, Terrence Caskey, Ellis Chau | 2015-07-28 |
| 9087815 | Off substrate kinking of bond wire | Belgacem Haba, Rizza Lee Saga Cizek, Wael Zohni | 2015-07-21 |
| 9082753 | Severing bond wire by kinking and twisting | Belgacem Haba, Rizza Lee Saga Cizek, Wael Zohni | 2015-07-14 |