Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9041227 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2015-05-26 |
| 8884403 | Semiconductor die array structure | DeAnn Eileen Melcher, Weiping Pan, Grant Villavicencio | 2014-11-11 |
| 8878353 | Structure for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Ilyas Mohammed, Terrence Caskey, Ellis Chau | 2014-11-04 |
| 8836136 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang +1 more | 2014-09-16 |
| 8772152 | Method for package-on-package assembly with wire bonds to encapsulation surface | Laura Wills Mirkarimi | 2014-07-08 |
| 8680687 | Electrical interconnect for die stacked in zig-zag configuration | Grant Villavicencio, Jeffrey S. Leal, Simon J. S. McElrea | 2014-03-25 |
| 8404520 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2013-03-26 |
| 8372741 | Method for package-on-package assembly with wire bonds to encapsulation surface | Laura Wills Mirkarimi | 2013-02-12 |
| 8324081 | Wafer level surface passivation of stackable integrated circuit chips | Simon J. S. McElrea, Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Lawrence Douglas Andrews, JR. +5 more | 2012-12-04 |
| 7923349 | Wafer level surface passivation of stackable integrated circuit chips | Simon J. S. McElrea, Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Lawrence Douglas Andrews, JR. +5 more | 2011-04-12 |
| 7863159 | Semiconductor die separation method | DeAnn Eileen Melcher, Weiping Pan, Grant Villavicencio | 2011-01-04 |