Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211821 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2025-01-28 |
| 11830845 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2023-11-28 |
| 11735563 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2023-08-22 |
| 11424211 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2022-08-23 |
| 11189595 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2021-11-30 |
| 10833044 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2020-11-10 |
| 10756049 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2020-08-25 |
| 10593643 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2020-03-17 |
| 10297582 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman +3 more | 2019-05-21 |
| 10062661 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2018-08-28 |
| 9984901 | Method for making a microelectronic assembly having conductive elements | Belgacem Haba, Teck-Gyu Kang, Ilyas Mohammed | 2018-05-29 |
| 9761558 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2017-09-12 |
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2017-06-27 |
| 9615456 | Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Ilyas Mohammed, Terrence Caskey, Reynaldo Co | 2017-04-04 |
| 9502390 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman +3 more | 2016-11-22 |
| 9349672 | Microelectronic package | Ilyas Mohammed, Belgacem Haba, Sean Moran, Wei-Shun Wang, Christopher Wade | 2016-05-24 |
| 9252122 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2016-02-02 |
| 9224717 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2015-12-29 |
| 9218988 | Microelectronic packages and methods therefor | Belgacem Haba, Teck-Gyu Kang, Ilyas Mohammed | 2015-12-22 |
| 9196581 | Flow underfill for microelectronic packages | Belgacem Haba, Ilyas Mohammed, Sang Il Lee, Kishor Desai | 2015-11-24 |
| 9136197 | Impedence controlled packages with metal sheet or 2-layer RDL | Belgacem Haba, Wael Zohni, Philip Damberg, Richard Dewitt Crisp | 2015-09-15 |
| 9105483 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2015-08-11 |
| 9095074 | Structure for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Ilyas Mohammed, Terrence Caskey, Reynaldo Co | 2015-07-28 |
| 9093435 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2015-07-28 |
| 9041227 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2015-05-26 |