| 12494453 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hisashi Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Chieh Wang +6 more |
2025-12-09 |
|
| 12211821 |
Package-on-package assembly with wire bond vias |
Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang |
2025-01-28 |
|
| 11830845 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2023-11-28 |
$9,095,000 |
| 11735563 |
Package-on-package assembly with wire bond vias |
Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang |
2023-08-22 |
|
| 11424211 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2022-08-23 |
$4,709,000 |
| 11189595 |
Package-on-package assembly with wire bond vias |
Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang |
2021-11-30 |
|
| 10833044 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2020-11-10 |
$12,559,000 |
| 10756049 |
Package-on-package assembly with wire bond vias |
Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang |
2020-08-25 |
|
| 10593643 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2020-03-17 |
$1,324,000 |
| 10297582 |
BVA interposer |
Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman +3 more |
2019-05-21 |
|
| 10062661 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2018-08-28 |
$8,921,000 |
| 9984901 |
Method for making a microelectronic assembly having conductive elements |
Belgacem Haba, Teck-Gyu Kang, Ilyas Mohammed |
2018-05-29 |
$11,328,000 |
| 9761558 |
Package-on-package assembly with wire bond vias |
Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang |
2017-09-12 |
|
| 9691731 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2017-06-27 |
$8,996,000 |
| 9615456 |
Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface |
Belgacem Haba, Ilyas Mohammed, Terrence Caskey, Reynaldo Co |
2017-04-04 |
|
| 9502390 |
BVA interposer |
Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman +3 more |
2016-11-22 |
|
| 9349672 |
Microelectronic package |
Ilyas Mohammed, Belgacem Haba, Sean Moran, Wei-Shun Wang, Christopher Wade |
2016-05-24 |
$9,360,000 |
| 9252122 |
Package-on-package assembly with wire bond vias |
Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang |
2016-02-02 |
|
| 9224717 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2015-12-29 |
$5,138,000 |
| 9218988 |
Microelectronic packages and methods therefor |
Belgacem Haba, Teck-Gyu Kang, Ilyas Mohammed |
2015-12-22 |
$10,865,000 |
| 9196581 |
Flow underfill for microelectronic packages |
Belgacem Haba, Ilyas Mohammed, Sang Il Lee, Kishor Desai |
2015-11-24 |
$11,254,000 |
| 9136197 |
Impedence controlled packages with metal sheet or 2-layer RDL |
Belgacem Haba, Wael Zohni, Philip Damberg, Richard Dewitt Crisp |
2015-09-15 |
$6,117,000 |
| 9105483 |
Package-on-package assembly with wire bond vias |
Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang |
2015-08-11 |
|
| 9095074 |
Structure for microelectronic packaging with bond elements to encapsulation surface |
Belgacem Haba, Ilyas Mohammed, Terrence Caskey, Reynaldo Co |
2015-07-28 |
|
| 9093435 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2015-07-28 |
$6,380,000 |