Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9029759 | Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same | Harpuneet Singh, Giles Humpston, Eddie Alex Azuma, Peter Pietrangelo, Ocie Ward | 2015-05-12 |
| 8981579 | Impedance controlled packages with metal sheet or 2-layer rdl | Belgacem Haba, Wael Zohni, Philip Damberg, Richard Dewitt Crisp | 2015-03-17 |
| 8940630 | Method of making wire bond vias and microelectronic package having wire bond vias | Philip Damberg, Zhijun Zhao | 2015-01-27 |
| 8878353 | Structure for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Ilyas Mohammed, Terrence Caskey, Reynaldo Co | 2014-11-04 |
| 8836136 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang +1 more | 2014-09-16 |
| 8786083 | Impedance controlled packages with metal sheet or 2-layer RDL | Belgacem Haba, Wael Zohni, Philip Damberg, Richard Dewitt Crisp | 2014-07-22 |
| 8728865 | Microelectronic packages and methods therefor | Belgacem Haba, Teck-Gyu Kang, Ilyas Mohammed | 2014-05-20 |
| 8697492 | No flow underfill | Belgacem Haba, Ilyas Mohammed, Sang Il Lee, Kishor Desai | 2014-04-15 |
| 8618659 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2013-12-31 |
| 8404520 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2013-03-26 |
| 8299626 | Microelectronic package | Ilyas Mohammed, Belgacem Haba, Sean Moran, Wei-Shun Wang, Christopher Wade | 2012-10-30 |
| 8222725 | Metal can impedance control structure | Belgacem Haba, Wael Zohni, Richard Dewitt Crisp | 2012-07-17 |
| 8093697 | Microelectronic packages and methods therefor | Belgacem Haba, Teck-Gyu Kang, Ilyas Mohammed | 2012-01-10 |
| 8058101 | Microelectronic packages and methods therefor | Belgacem Haba, Teck-Gyu Kang, Ilyas Mohammed | 2011-11-15 |