Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830845 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Wei-Shun Wang, Ellis Chau +6 more | 2023-11-28 |
| 11424211 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Wei-Shun Wang, Ellis Chau +6 more | 2022-08-23 |
| 10833044 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Wei-Shun Wang, Ellis Chau +6 more | 2020-11-10 |
| 10593643 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Wei-Shun Wang, Ellis Chau +6 more | 2020-03-17 |
| 10062661 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Wei-Shun Wang, Ellis Chau +6 more | 2018-08-28 |
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Wei-Shun Wang, Ellis Chau +6 more | 2017-06-27 |
| 9633968 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Belgacem Haba, Wael Zohni | 2017-04-25 |
| 9224717 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Wei-Shun Wang, Ellis Chau +6 more | 2015-12-29 |
| 9105612 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Belgacem Haba, Wael Zohni | 2015-08-11 |
| 9093435 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Wei-Shun Wang, Ellis Chau +6 more | 2015-07-28 |
| 8816514 | Microelectronic assembly with joined bond elements having lowered inductance | Belgacem Haba, Philip Damberg | 2014-08-26 |
| 8618659 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Wei-Shun Wang, Ellis Chau +6 more | 2013-12-31 |
| 8541873 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Belgacem Haba, Wael Zohni | 2013-09-24 |
| 8410618 | Microelectronic assembly with joined bond elements having lowered inductance | Belgacem Haba, Philip Damberg | 2013-04-02 |
| 8008785 | Microelectronic assembly with joined bond elements having lowered inductance | Belgacem Haba, Philip Damberg | 2011-08-30 |
| 7994622 | Microelectronic packages having cavities for receiving microelectric elements | Ilyas Mohammed, Belgacem Haba, Wael Zohni | 2011-08-09 |
| 7268304 | Microelectronic connection components having bondable wires | Masud Beroz, Jae M. Park, Belgacem Haba, Fion Tan | 2007-09-11 |
| 7061122 | Components, methods and assemblies for multi-chip packages | Young Gon Kim, David Gibson, Michael Warner, Philip Damberg | 2006-06-13 |
| 6214640 | Method of manufacturing a plurality of semiconductor packages | Jennifer Fosberry, Masud Beroz, Mihalis Michael | 2001-04-10 |