DG

David Gibson

TE Tessera: 17 patents #25 of 271Top 10%
Google: 1 patents #14,769 of 22,993Top 65%
Overall (All Time): #257,037 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9437582 Stacked microelectronic assemblies Andy Stavros 2016-09-06
8704351 Stacked microelectronic assemblies Andy Stavros 2014-04-22
7939934 Microelectronic packages and methods therefor Belgacem Haba 2011-05-10
7935569 Components, methods and assemblies for stacked packages Kyong-Mo Bang, Young Gon Kim, John Riley 2011-05-03
7589409 Stacked packages and microelectronic assemblies incorporating the same Andy Stavros 2009-09-15
7335995 Microelectronic assembly having array including passive elements and interconnects L. Pflughaupt, Young Gon Kim, Craig Mitchell, Wael Zohni, Ilyas Mohammed 2008-02-26
7294928 Components, methods and assemblies for stacked packages Kyong-Mo Bang, Young Gon Kim, John Riley 2007-11-13
7183643 Stacked packages and systems incorporating the same Andy Stavros 2007-02-27
7149095 Stacked microelectronic assemblies Michael Warner, Philip Damberg, John Riley, Young Gon Kim, Belgacem Haba +1 more 2006-12-12
7061122 Components, methods and assemblies for multi-chip packages Young Gon Kim, Michael Warner, Philip Damberg, Philip R. Osborn 2006-06-13
6977440 Stacked packages L. Pflughaupt, Young Gon Kim, Craig Mitchell, Wael Zohni, Ilyas Mohammed 2005-12-20
6913949 Stacked packages L. Pflughaupt, Young Gon Kim, Craig Mitchell 2005-07-05
6897565 Stacked packages L. Pflughaupt, Young Gon Kim, Craig Mitchell 2005-05-24
6888229 Connection components with frangible leads and bus Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, Jason Sweis +1 more 2005-05-03
6081035 Microelectronic bond ribbon design Michael Warner, Thomas H. DiStefano 2000-06-27
6054756 Connection components with frangible leads and bus Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, Jason Sweis +1 more 2000-04-25
5915752 Method of making connections to a semiconductor chip assembly Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, Jason Sweis +1 more 1999-06-29
D276090 Container for carrying articles 1984-10-23