Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341083 | Electronic device cooling structures bonded to semiconductor elements | Belgacem Haba, Gaius Gillman Fountain, Jr., Thomas Workman, Ron Zhang | 2025-06-24 |
| 12322677 | Fluid channel geometry optimizations to improve cooling efficiency | Ron Zhang, Gaius Gillman Fountain, Jr., Belgacem Haba, Laura Wills Mirkarimi, Suhail Jaan Sadiq | 2025-06-03 |
| 12191234 | Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same | Gaius Gillman Fountain, Jr., Belgacem Haba | 2025-01-07 |
| 10566310 | Microelectronic packages having stacked die and wire bond interconnects | Belgacem Haba | 2020-02-18 |
| 10468380 | Stackable microelectronic package structures | Belgacem Haba | 2019-11-05 |
| 10026467 | High-bandwidth memory application with controlled impedance loading | Zhuowen Sun, Yong-Syuan Chen | 2018-07-17 |
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Xuan Li, Long Huynh +4 more | 2018-06-26 |
| 9928883 | TFD I/O partition for high-speed, high-density applications | Zhuowen Sun, Belgacem Haba, Wael Zohni | 2018-03-27 |
| 9911717 | Stackable microelectronic package structures | Belgacem Haba | 2018-03-06 |
| 9847238 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-12-19 |
| 9679613 | TFD I/O partition for high-speed, high-density applications | Zhuowen Sun, Belgacem Haba, Wael Zohni | 2017-06-13 |
| 9646946 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-05-09 |
| 9543277 | Wafer level packages with mechanically decoupled fan-in and fan-out areas | Bongsub Lee, Tu Tam Vu, Rajesh Katkar, Laura Wills Mirkarimi, Akash Agrawal +3 more | 2017-01-10 |
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Xuan Li, Long Huynh +4 more | 2016-11-22 |
| 9484080 | High-bandwidth memory application with controlled impedance loading | Zhuowen Sun, Yong-Syuan Chen | 2016-11-01 |
| 9425167 | Stackable microelectronic package structures | Belgacem Haba | 2016-08-23 |
| 9349707 | Contact arrangements for stackable microelectronic package structures with multiple ranks | Zhuowen Sun, Yong-Syuan Chen | 2016-05-24 |
| 9343398 | BGA ballout partition techniques for simplified layout in motherboard with multiple power supply rail | Yong-Syuan Chen, Zhuowen Sun | 2016-05-17 |
| 9337170 | Contact arrangements for stackable microelectronic package structures | Zhuowen Sun, Yong-Syuan Chen | 2016-05-10 |
| 9281296 | Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design | Zhuowen Sun, Yong-Syuan Chen | 2016-03-08 |
| 8980693 | Stackable microelectronic package structures | Belgacem Haba | 2015-03-17 |
| 8680684 | Stackable microelectronic package structures | Belgacem Haba | 2014-03-25 |
| 7935569 | Components, methods and assemblies for stacked packages | David Gibson, Young Gon Kim, John Riley | 2011-05-03 |
| 7294928 | Components, methods and assemblies for stacked packages | David Gibson, Young Gon Kim, John Riley | 2007-11-13 |
| 7246431 | Methods of making microelectronic packages including folded substrates | Teck-Gyu Kang | 2007-07-24 |