Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12285373 | Techniques for notifying persons within a vicinity of a patient support apparatus of a remote control function | Anuj K. Sidhu, Alexander Josef Bodurka, Brajesh Kumar, Sachin Pachauri, Chandra Bhanu Vats | 2025-04-29 |
| 12278172 | Substrate frame design for three-dimensional stacked electronic assemblies and method for the same | Prashanth Ganeshbaabu | 2025-04-15 |
| 11675611 | Software service intervention in a computing system | Anupam Chakraborty | 2023-06-13 |
| 10983879 | System and method for managing recovery of multi-controller NVMe drives | Timothy Johnson, Jiahui Wang, Peng Yin, Stephen Richard Ives, Michael Garvey +1 more | 2021-04-20 |
| 10962137 | Universal adapter assembly for valve actuator | Mayank Awasthi, Kapil Das Sahu | 2021-03-30 |
| 10905611 | Techniques for notifying persons within a vicinity of a patient support apparatus of a remote control function | Anuj K. Sidhu, Alexander Josef Bodurka, Brajesh Kumar, Sachin Pachauri, Chandra Bhanu Vats | 2021-02-02 |
| 10790222 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Belgacem Haba, Wael Zohni, Liang Wang | 2020-09-29 |
| 10354945 | Multi-surface edge pads for vertical mount packages and methods of making package stacks | Rajesh Katkar, Min Tao, Javier A. Delacruz, Hoki Kim | 2019-07-16 |
| 10283445 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Belgacem Haba, Wael Zohni, Liang Wang | 2019-05-07 |
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2018-06-26 |
| 9859234 | Methods and structures to repair device warpage | Cyprian Emeka Uzoh, Guilian Gao, Bongsub Lee, Scott McGrath, Hong Shen +2 more | 2018-01-02 |
| 9847238 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-12-19 |
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram +2 more | 2017-11-21 |
| 9728524 | Enhanced density assembly having microelectronic packages mounted at substantial angle to board | Min Tao, Zhuowen Sun, Hoki Kim, Wael Zohni | 2017-08-08 |
| 9646946 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-05-09 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram +2 more | 2017-01-17 |
| 9543277 | Wafer level packages with mechanically decoupled fan-in and fan-out areas | Bongsub Lee, Tu Tam Vu, Rajesh Katkar, Laura Wills Mirkarimi, Kyong-Mo Bang +3 more | 2017-01-10 |
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2016-11-22 |
| 9471550 | Method and apparatus for document conversion with font metrics adjustment for format compatibility | Jonathan Boutelle, Kapil Gupta, Michael Brown, Christopher S. Ahlers, Jeba Singh Emmanuel +1 more | 2016-10-18 |