Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255153 | Wire bond wires for interference shielding | Abiola Awujoola, Wael Zohni, Ashok S. Prabhu, Willmar Subido | 2025-03-18 |
| 11810867 | Wire bond wires for interference shielding | Abiola Awujoola, Wael Zohni, Ashok S. Prabhu, Willmar Subido | 2023-11-07 |
| 11462483 | Wire bond wires for interference shielding | Abiola Awujoola, Wael Zohni, Ashok S. Prabhu, Willmar Subido | 2022-10-04 |
| 10700002 | Ultra high performance interposer | Cyprian Emeka Uzoh | 2020-06-30 |
| 10559537 | Wire bond wires for interference shielding | Abiola Awujoola, Wael Zohni, Ashok S. Prabhu, Willmar Subido | 2020-02-11 |
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Liang Wang +1 more | 2019-12-31 |
| 10354976 | Dies-on-package devices and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Wael Zohni, Belgacem Haba | 2019-07-16 |
| 10332833 | Ultra high performance interposer | Cyprian Emeka Uzoh | 2019-06-25 |
| 10325877 | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces | Javier A. Delacruz, Abiola Awujoola, Ashok S. Prabhu, Christopher W. Lattin | 2019-06-18 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Liang Wang +1 more | 2019-01-08 |
| 10115678 | Wire bond wires for interference shielding | Abiola Awujoola, Wael Zohni, Ashok S. Prabhu, Willmar Subido | 2018-10-30 |
| 10103093 | Via structure for signal equalization | Cyprian Emeka Uzoh, Yong-Syuan Chen | 2018-10-16 |
| 10032715 | Ultra high performance interposer | Cyprian Emeka Uzoh | 2018-07-24 |
| 10026467 | High-bandwidth memory application with controlled impedance loading | Yong-Syuan Chen, Kyong-Mo Bang | 2018-07-17 |
| 10007622 | Method for reduced load memory module | Yong-Syuan Chen | 2018-06-26 |
| 9991233 | Package-on-package devices with same level WLP components and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Wael Zohni, Belgacem Haba | 2018-06-05 |
| 9991235 | Package on-package devices with upper RDL of WLPS and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Wael Zohni, Belgacem Haba | 2018-06-05 |
| 9985007 | Package on-package devices with multiple levels and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Wael Zohni, Belgacem Haba | 2018-05-29 |
| 9984992 | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces | Javier A. Delacruz, Abiola Awujoola, Ashok S. Prabhu, Christopher W. Lattin | 2018-05-29 |
| 9972609 | Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Wael Zohni, Belgacem Haba | 2018-05-15 |
| 9972573 | Wafer-level packaged components and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Wael Zohni, Belgacem Haba | 2018-05-15 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Liang Wang +1 more | 2018-04-17 |
| 9928883 | TFD I/O partition for high-speed, high-density applications | Kyong-Mo Bang, Belgacem Haba, Wael Zohni | 2018-03-27 |
| 9905507 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Hong Shen, Charles G. Woychik, Arkalgud R. Sitaram | 2018-02-27 |
| 9812402 | Wire bond wires for interference shielding | Abiola Awujoola, Wael Zohni, Ashok S. Prabhu, Willmar Subido | 2017-11-07 |