Issued Patents All Time
Showing 1–25 of 143 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431449 | Circuitry for electrical redundancy in bonded structures | Belgacem Haba, Jung Ko | 2025-09-30 |
| 12401010 | 3D processor having stacked integrated circuit die | Steven Teig, Ilyas Mohammed, Kenneth Duong | 2025-08-26 |
| 12362182 | Direct-bonded native interconnects and active base die | Steven Teig, Shaowu Huang, William C. Plants, David Edward Fisch | 2025-07-15 |
| 12308332 | Circuitry for electrical redundancy in bonded structures | Belgacem Haba, Jung Ko | 2025-05-20 |
| 12293993 | 3D chip sharing data bus | Steven Teig, Ilyas Mohammed | 2025-05-06 |
| 12293108 | 3D memory circuit | David Edward Fisch | 2025-05-06 |
| 12288771 | Apparatus for non-volatile random access memory stacks | Belgacem Haba, Rajesh Katkar, Pearl Po-Yee Cheng | 2025-04-29 |
| 12283572 | Symbiotic network on layers | Belgacem Haba, Rajesh Katkar | 2025-04-22 |
| 12278215 | Integrated voltage regulator and passive components | Don Draper, Belgacem Haba, Ilyas Mohammed | 2025-04-15 |
| 12271032 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Liang Wang, Guilian Gao | 2025-04-08 |
| 12272730 | Transistor level interconnection methodologies utilizing 3D interconnects | David Edward Fisch | 2025-04-08 |
| 12255176 | Scalable architecture for reduced cycles across SOC | Richard E. Perego | 2025-03-18 |
| 12218059 | Stacked IC structure with orthogonal interconnect layers | Ilyas Mohammed, Steven Teig | 2025-02-04 |
| 12176303 | Wafer-level bonding of obstructive elements | Rajesh Katkar | 2024-12-24 |
| 12174246 | Security circuitry for bonded structures | Belgacem Haba, Guy Regev | 2024-12-24 |
| 12154858 | Connecting multiple chips using an interconnect device | Belgacem Haba | 2024-11-26 |
| 12142528 | 3D chip with shared clock distribution network | Steven Teig, Ilyas Mohammed, Eric Nequist | 2024-11-12 |
| 12113054 | Non-volatile dynamic random access memory | Pearl Po-Yee Cheng, David Edward Fisch | 2024-10-08 |
| 12100684 | Bonded structures | Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2024-09-24 |
| 12094835 | Wire bonding method and apparatus for electromagnetic interference shielding | Shaowu Huang | 2024-09-17 |
| 12080672 | Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive | Belgacem Haba, Laura Wills Mirkarimi, Rajesh Katkar, Cyprian Emeka Uzoh, Guilian Gao +1 more | 2024-09-03 |
| 12074092 | Hard IP blocks with physically bidirectional passageways | — | 2024-08-27 |
| 12057383 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Shaowu Huang +1 more | 2024-08-06 |
| 11967575 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Shaowu Huang, Liang Wang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2024-04-23 |
| 11929347 | Mixed exposure for large die | Belgacem Haba | 2024-03-12 |