Issued Patents All Time
Showing 51–75 of 143 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515291 | Integrated voltage regulator and passive components | Don Draper, Belgacem Haba, Ilyas Mohammed | 2022-11-29 |
| 11476213 | Bonded structures without intervening adhesive | Belgacem Haba, Rajesh Katkar, Ilyas Mohammed | 2022-10-18 |
| 11469214 | Stacked architecture for three-dimensional NAND | Stephen L. Morein, Xu Chang, Belgacem Haba, Rajesh Katkar | 2022-10-11 |
| 11385278 | Security circuitry for bonded structures | Belgacem Haba, Guy Regev | 2022-07-12 |
| 11373963 | Protective elements for bonded structures | Belgacem Haba, Rajesh Katkar | 2022-06-28 |
| 11369020 | Stacked transmission line | Shaowu Huang, Belgacem Haba | 2022-06-21 |
| 11355443 | Dielets on flexible and stretchable packaging for microelectronics | Shaowu Huang | 2022-06-07 |
| 11348898 | Systems and methods for releveled bump planes for chiplets | Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar, Ilyas Mohammed | 2022-05-31 |
| 11335647 | Wire bonding method and apparatus for electromagnetic interference shielding | Shaowu Huang | 2022-05-17 |
| 11296044 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Shaowu Huang, Liang Wang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2022-04-05 |
| 11289333 | Direct-bonded native interconnects and active base die | Steven Teig, Shaowu Huang, William C. Plants, David Edward Fisch | 2022-03-29 |
| 11270979 | Symbiotic network on layers | Belgacem Haba, Rajesh Katkar | 2022-03-08 |
| 11264357 | Mixed exposure for large die | Belgacem Haba | 2022-03-01 |
| 11264361 | Network on layer enabled architectures | Belgacem Haba | 2022-03-01 |
| 11205625 | Wafer-level bonding of obstructive elements | Rajesh Katkar | 2021-12-21 |
| 11169326 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Liang Wang, Guilian Gao | 2021-11-09 |
| 11157670 | Systems and methods for inter-die block level design | Eric Nequist, Jung Ko, Kenneth Duong | 2021-10-26 |
| 11152336 | 3D processor having stacked integrated circuit die | Steven Teig, Ilyas Mohammed, Kenneth Duong | 2021-10-19 |
| 11139283 | Abstracted NAND logic in stacks | Stephen L. Morein | 2021-10-05 |
| 11127738 | Back biasing of FD-SOI circuit blocks | David Edward Fisch, Kenneth Duong, Xu Chang, Liang Wang | 2021-09-21 |
| 11063017 | Embedded organic interposer for high bandwidth | Belgacem Haba | 2021-07-13 |
| 11024220 | Formation of a light-emitting diode display | Liang Wang, Rajesh Katkar, Ilyas Mohammed, Belgacem Haba | 2021-06-01 |
| 10998265 | Interface structures and methods for forming same | Shaowu Huang | 2021-05-04 |
| 10991804 | Transistor level interconnection methodologies utilizing 3D interconnects | David Edward Fisch | 2021-04-27 |
| 10991676 | Systems and methods for flash stacking | Belgacem Haba, Ilyas Mohammed | 2021-04-27 |