Issued Patents All Time
Showing 25 most recent of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381119 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Guilian Gao, Ilyas Mohammed | 2025-08-05 |
| 12362182 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, William C. Plants, David Edward Fisch | 2025-07-15 |
| 12322667 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Guilian Gao, Ilyas Mohammed | 2025-06-03 |
| 12317414 | Common-mode filtering for converting differential signaling to single-ended signaling | Dance Wu | 2025-05-27 |
| 12271032 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Javier A. Delacruz, Liang Wang, Guilian Gao | 2025-04-08 |
| 12094835 | Wire bonding method and apparatus for electromagnetic interference shielding | Javier A. Delacruz | 2024-09-17 |
| 12088090 | Electrostatic discharge protection apparatus and method for data transceiver | Dance Wu | 2024-09-10 |
| 12057383 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz +1 more | 2024-08-06 |
| 12028966 | Printed circuit board including on-board integrated enclosure for electromagnetic compatibility shielding | Dance Wu | 2024-07-02 |
| 11967575 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Liang Wang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2024-04-23 |
| 11903123 | Common-mode filtering for converting differential signaling to single-ended signaling | Dance Wu | 2024-02-13 |
| 11860415 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Javier A. Delacruz, Liang Wang, Guilian Gao | 2024-01-02 |
| 11837556 | Wire bonding method and apparatus for electromagnetic interference shielding | Javier A. Delacruz | 2023-12-05 |
| 11823906 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, William C. Plants, David Edward Fisch | 2023-11-21 |
| 11765822 | Printed circuit boards with meshed conductive structures | Dance Wu | 2023-09-19 |
| 11737207 | PCB RF noise grounding for shielded high-speed interface cable | Dance Wu | 2023-08-22 |
| 11711225 | Reduction of power-over-data-lines (PODL) filter parasitics for multi-gigabit ethernet | Dance Wu | 2023-07-25 |
| 11711591 | Common-mode filtering for high-speed cable interface | Dance Wu | 2023-07-25 |
| 11696426 | Automotive network communication devices and cabling with electromagnetic shielding | Dance Wu | 2023-07-04 |
| 11626363 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz +1 more | 2023-04-11 |
| 11600542 | Cavity packages | Javier A. Delacruz, Liang Wang, Rajesh Katkar, Belgacem Haba | 2023-03-07 |
| 11570887 | On-board integrated enclosure for electromagnetic compatibility shielding | Dance Wu | 2023-01-31 |
| 11417576 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Guilian Gao, Ilyas Mohammed | 2022-08-16 |
| 11395401 | Printed circuit board structure and method for improved electromagnetic compatibility performance | Dance Wu | 2022-07-19 |
| 11369020 | Stacked transmission line | Javier A. Delacruz, Belgacem Haba | 2022-06-21 |