Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355443 | Dielets on flexible and stretchable packaging for microelectronics | Javier A. Delacruz | 2022-06-07 |
| 11335647 | Wire bonding method and apparatus for electromagnetic interference shielding | Javier A. Delacruz | 2022-05-17 |
| 11296044 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Liang Wang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2022-04-05 |
| 11289333 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, William C. Plants, David Edward Fisch | 2022-03-29 |
| 11257727 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Guilian Gao, Ilyas Mohammed | 2022-02-22 |
| 11169326 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Javier A. Delacruz, Liang Wang, Guilian Gao | 2021-11-09 |
| 11122677 | Printed circuit board structure and method for inductive noise cancellation | Dance Wu | 2021-09-14 |
| 10998265 | Interface structures and methods for forming same | Javier A. Delacruz | 2021-05-04 |
| 10923408 | Cavity packages | Javier A. Delacruz, Liang Wang, Rajesh Katkar, Belgacem Haba | 2021-02-16 |
| 10832912 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, William C. Plants, David Edward Fisch | 2020-11-10 |
| 10784191 | Interface structures and methods for forming same | Belgacem Haba, Javier A. Delacruz | 2020-09-22 |
| 10719649 | Full wave modeling and simulations of the waveguide behavior of printed circuit boards using a broadband green's function technique | Leung W. Tsang | 2020-07-21 |
| 10658302 | Wire bonding method and apparatus for electromagnetic interference shielding | Javier A. Delacruz | 2020-05-19 |
| 10658313 | Selective recess | Javier A. Delacruz, Rajesh Katkar, Gaius Gillman Fountain, Jr., Liang Wang, Laura Wills Mirkarimi | 2020-05-19 |
| 10535909 | Methods of forming flipped RF filter components | Belgacem Haba | 2020-01-14 |
| 10522352 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, William C. Plants, David Edward Fisch | 2019-12-31 |
| 10508030 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Guilian Gao, Ilyas Mohammed | 2019-12-17 |
| 10446487 | Interface structures and methods for forming same | Javier A. Delacruz | 2019-10-15 |
| 10403577 | Dielets on flexible and stretchable packaging for microelectronics | Javier A. Delacruz | 2019-09-03 |
| 10299368 | Surface integrated waveguides and circuit structures therefor | Javier A. Delacruz | 2019-05-21 |
| 10276909 | Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein | Javier A. Delacruz, Belgacem Haba | 2019-04-30 |
| 10149377 | Stacked transmission line | Javier A. Delacruz, Belgacem Haba | 2018-12-04 |
| 10109903 | Flipped RF filters and components | Belgacem Haba | 2018-10-23 |
| 9954332 | Memory module adaptor card | Beom-Taek Lee | 2018-04-24 |
| 9946825 | Full wave modeling and simulations of the waveguide behavior of printed circuit boards using a broadband green's function technique | Leung W. Tsang | 2018-04-17 |