Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272677 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more | 2025-04-08 |
| 12124035 | Stretchable film assembly with conductive traces | Belgacem Haba, Ilyas Mohammed, Min Tao | 2024-10-22 |
| 12057383 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Javier A. Delacruz, Shaowu Huang +1 more | 2024-08-06 |
| 11955463 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more | 2024-04-09 |
| 11626363 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Javier A. Delacruz, Shaowu Huang +1 more | 2023-04-11 |
| 11296053 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more | 2022-04-05 |
| 11246230 | Configurable smart object system with methods of making modules and contactors | Belgacem Haba, Ilyas Mohammed, Min Tao | 2022-02-08 |
| 11239587 | Configurable smart object system with clip-based connectors | Belgacem Haba, Ilyas Mohammed, Min Tao | 2022-02-01 |
| 10955671 | Stretchable film assembly with conductive traces | Belgacem Haba, Ilyas Mohammed, Min Tao | 2021-03-23 |
| 10750614 | Deformable electrical contacts with conformable target pads | Belgacem Haba | 2020-08-18 |
| 10734759 | Configurable smart object system with magnetic contacts and magnetic assembly | Belgacem Haba, Ilyas Mohammed, Min Tao | 2020-08-04 |
| 10586759 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2020-03-10 |
| 10483217 | Warpage balancing in thin packages | Belgacem Haba, Sangil Lee, Craig Mitchell, Javier A. Delacruz | 2019-11-19 |
| 10332854 | Anchoring structure of fine pitch bva | Rajesh Katkar, Xuan Li, Cyprian Emeka Uzoh, Guilian Gao, Liang Wang | 2019-06-25 |
| 10014243 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2018-07-03 |
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2018-06-26 |
| 9972582 | Warpage balancing in thin packages | Belgacem Haba, Sangil Lee, Craig Mitchell, Javier A. Delacruz | 2018-05-15 |
| 9847238 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-12-19 |
| 9646946 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-05-09 |
| 9583426 | Multi-layer substrates suitable for interconnection between circuit modules | Hong Shen, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2017-02-28 |
| 9543277 | Wafer level packages with mechanically decoupled fan-in and fan-out areas | Bongsub Lee, Tu Tam Vu, Rajesh Katkar, Laura Wills Mirkarimi, Akash Agrawal +3 more | 2017-01-10 |
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2016-11-22 |
| 9390998 | Heat spreading substrate | Ilyas Mohammed, Liang Wang | 2016-07-12 |
| 8785961 | Heat spreading substrate | — | 2014-07-22 |