| 12243851 |
Offset pads over TSV |
Guilian Gao |
2025-03-04 |
| 12205926 |
TSV as pad |
Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more |
2025-01-21 |
| 11955393 |
Structures for bonding elements including conductive interface features |
Rajesh Katkar, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh |
2024-04-09 |
| 11955445 |
Metal pads over TSV |
Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more |
2024-04-09 |
| 11749645 |
TSV as pad |
Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more |
2023-09-05 |
| 11728313 |
Offset pads over TSV |
Guilian Gao |
2023-08-15 |
| 11393779 |
Large metal pads over TSV |
Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more |
2022-07-19 |
| 11004757 |
Bonded structures |
Rajesh Katkar, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh |
2021-05-11 |
| 10998292 |
Offset pads over TSV |
Guilian Gao |
2021-05-04 |
| 10600761 |
Nanoscale interconnect array for stacked dies |
Liang Wang, Belgacem Haba, Sangil Lee |
2020-03-24 |
| 10304803 |
Nanoscale interconnect array for stacked dies |
Liang Wang, Belgacem Haba, Sangil Lee |
2019-05-28 |
| 10008469 |
Wafer-level packaging using wire bond wires in place of a redistribution layer |
Rajesh Katkar, Tu Tam Vu, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more |
2018-06-26 |
| 9859234 |
Methods and structures to repair device warpage |
Cyprian Emeka Uzoh, Guilian Gao, Scott McGrath, Hong Shen, Charles G. Woychik +2 more |
2018-01-02 |
| 9847238 |
Fan-out wafer-level packaging using metal foil lamination |
Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Gabriel Z. Guevara +3 more |
2017-12-19 |
| 9646946 |
Fan-out wafer-level packaging using metal foil lamination |
Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Gabriel Z. Guevara +3 more |
2017-05-09 |
| 9543277 |
Wafer level packages with mechanically decoupled fan-in and fan-out areas |
Tu Tam Vu, Rajesh Katkar, Laura Wills Mirkarimi, Akash Agrawal, Kyong-Mo Bang +3 more |
2017-01-10 |
| 9502372 |
Wafer-level packaging using wire bond wires in place of a redistribution layer |
Rajesh Katkar, Tu Tam Vu, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more |
2016-11-22 |