Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243851 | Offset pads over TSV | Guilian Gao | 2025-03-04 |
| 12205926 | TSV as pad | Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more | 2025-01-21 |
| 11955393 | Structures for bonding elements including conductive interface features | Rajesh Katkar, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh | 2024-04-09 |
| 11955445 | Metal pads over TSV | Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more | 2024-04-09 |
| 11749645 | TSV as pad | Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more | 2023-09-05 |
| 11728313 | Offset pads over TSV | Guilian Gao | 2023-08-15 |
| 11393779 | Large metal pads over TSV | Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more | 2022-07-19 |
| 11004757 | Bonded structures | Rajesh Katkar, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh | 2021-05-11 |
| 10998292 | Offset pads over TSV | Guilian Gao | 2021-05-04 |
| 10600761 | Nanoscale interconnect array for stacked dies | Liang Wang, Belgacem Haba, Sangil Lee | 2020-03-24 |
| 10304803 | Nanoscale interconnect array for stacked dies | Liang Wang, Belgacem Haba, Sangil Lee | 2019-05-28 |
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more | 2018-06-26 |
| 9859234 | Methods and structures to repair device warpage | Cyprian Emeka Uzoh, Guilian Gao, Scott McGrath, Hong Shen, Charles G. Woychik +2 more | 2018-01-02 |
| 9847238 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Gabriel Z. Guevara +3 more | 2017-12-19 |
| 9646946 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Gabriel Z. Guevara +3 more | 2017-05-09 |
| 9543277 | Wafer level packages with mechanically decoupled fan-in and fan-out areas | Tu Tam Vu, Rajesh Katkar, Laura Wills Mirkarimi, Akash Agrawal, Kyong-Mo Bang +3 more | 2017-01-10 |
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more | 2016-11-22 |