Bongsub Lee — 18 Patents at Invensas

Bongsub Lee has been granted 18 US patents while listed as an inventor at Invensas. The first was granted in 2016 and the most recent in October 2025. Bongsub Lee ranks #245,716 of 4,157,543 US inventors in our database (top 5.9%). Patent records list Bongsub Lee in Santa Clara, CA, US.

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #	Title	Co-Inventors	Date
12444661	Pattern design for integrated circuits and method for inspecting the pattern design for integrated circuits	Jong Soo Baek, Jin-Yub Lee, Min Soo Kang, Hyun Ah Roh	2025-10-14
12243851	Offset pads over TSV	Guilian Gao	2025-03-04
12205926	TSV as pad	Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more	2025-01-21
11955445	Metal pads over TSV	Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more	2024-04-09
11955393	Structures for bonding elements including conductive interface features	Rajesh Katkar, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh	2024-04-09
11749645	TSV as pad	Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more	2023-09-05
11728313	Offset pads over TSV	Guilian Gao	2023-08-15
11393779	Large metal pads over TSV	Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more	2022-07-19
11004757	Bonded structures	Rajesh Katkar, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh	2021-05-11
10998292	Offset pads over TSV	Guilian Gao	2021-05-04
10600761	Nanoscale interconnect array for stacked dies	Liang Wang, Belgacem Haba, Sangil Lee	2020-03-24
10304803	Nanoscale interconnect array for stacked dies	Liang Wang, Belgacem Haba, Sangil Lee	2019-05-28
10008469	Wafer-level packaging using wire bond wires in place of a redistribution layer	Rajesh Katkar, Tu Tam Vu, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more	2018-06-26
9859234	Methods and structures to repair device warpage	Cyprian Emeka Uzoh, Guilian Gao, Scott McGrath, Hong Shen, Charles G. Woychik +2 more	2018-01-02
9847238	Fan-out wafer-level packaging using metal foil lamination	Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Gabriel Z. Guevara +3 more	2017-12-19
9646946	Fan-out wafer-level packaging using metal foil lamination	Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Gabriel Z. Guevara +3 more	2017-05-09
9543277	Wafer level packages with mechanically decoupled fan-in and fan-out areas	Tu Tam Vu, Rajesh Katkar, Laura Wills Mirkarimi, Akash Agrawal, Kyong-Mo Bang +3 more	2017-01-10
9502372	Wafer-level packaging using wire bond wires in place of a redistribution layer	Rajesh Katkar, Tu Tam Vu, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more	2016-11-22

Bongsub Lee — 18 Patents

Issued Patents All Time

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