Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Bongsub Lee, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more | 2018-06-26 |
| 9859257 | Flipped die stacks with multiple rows of leadframe interconnects | Javier A. Delacruz, Belgacem Haba, Rajesh Katkar | 2018-01-02 |
| 9847238 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-12-19 |
| 9646946 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-05-09 |
| 9543277 | Wafer level packages with mechanically decoupled fan-in and fan-out areas | Bongsub Lee, Rajesh Katkar, Laura Wills Mirkarimi, Akash Agrawal, Kyong-Mo Bang +3 more | 2017-01-10 |
| 9508691 | Flipped die stacks with multiple rows of leadframe interconnects | Javier A. Delacruz, Belgacem Haba, Rajesh Katkar | 2016-11-29 |
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Bongsub Lee, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more | 2016-11-22 |