Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11549681 | Water heater and boiler processes | Kunal Shah, Nery Hernandez, Joseph Bentitou | 2023-01-10 |
| 10254386 | Waveform model | Andre Beaudin, Gilbert Moineau | 2019-04-09 |
| 10062099 | Product identification based on location associated with image of product | — | 2018-08-28 |
| 9859234 | Methods and structures to repair device warpage | Cyprian Emeka Uzoh, Guilian Gao, Bongsub Lee, Hong Shen, Charles G. Woychik +2 more | 2018-01-02 |
| 9824999 | Semiconductor die mount by conformal die coating | Scott Jay Crane, Simon J. S. McElrea, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson | 2017-11-21 |
| 9825002 | Flipped die stack | Rajesh Katkar, Reynaldo Co, Ashok S. Prabhu, Sangil Lee, Liang Wang +1 more | 2017-11-21 |
| 9659848 | Stiffened wires for offset BVA | Grant Villavicencio, Sangil Lee, Roseann Alatorre, Javier A. Delacruz | 2017-05-23 |
| 9508689 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Reynaldo Co, Jeffrey S. Leal, Suzette K. Pangrle, De Ann Eileen Melcher, Keith L. Barrie +3 more | 2016-11-29 |
| 9503915 | Dynamic beamforming configuration based on network conditions | Kalyan Dharanipragada, Gautam Bhanage, Venkatesh Kannan, Sachin Ganu | 2016-11-22 |
| 9438496 | Monitoring link quality between network devices | Gopalakrishna Raman, Kiranmaye Sirigineni, Neal Dante Castagnoli, Rajini Balay | 2016-09-06 |
| 9252116 | Semiconductor die mount by conformal die coating | Scott Jay Crane, Simon J. S. McElrea, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson | 2016-02-02 |
| 9153517 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Reynaldo Co, Jeffrey S. Leal, Suzette K. Pangrle, DeAnn Eileen Melcher, Keith L. Barrie +3 more | 2015-10-06 |
| 8912661 | Stacked die assembly having reduced stress electrical interconnects | Jeffrey S. Leal, Ravi Shenoy, Loreto Cantillep, Simon J. S. McElrea, Suzette K. Pangrle | 2014-12-16 |
| 8742602 | Vertical electrical interconnect formed on support prior to die mount | Terrence Caskey, Lawrence Douglas Andrews, JR., Simon J. S. McElrea, Yong Du, Mark A. Scott | 2014-06-03 |
| 8723332 | Electrically interconnected stacked die assemblies | Simon J. S. McElrea, Lawrence Douglas Andrews, JR., Terrence Caskey, Scott Jay Crane, Marc E. Robinson +1 more | 2014-05-13 |
| 8704379 | Semiconductor die mount by conformal die coating | Scott Jay Crane, Simon J. S. McElrea, Weiping Pan, DeAnn Eileen Melcher, Marc E. Robinson | 2014-04-22 |
| 8684092 | System and method for providing additional blowout preventer control redundancy | Brian Williams | 2014-04-01 |
| 8629543 | Electrically interconnected stacked die assemblies | Simon J. S. McElrea, Lawrence Douglas Andrews, JR., Terrence Caskey, Scott Jay Crane, Marc E. Robinson +1 more | 2014-01-14 |
| 8376051 | System and method for providing additional blowout preventer control redundancy | Brian Williams | 2013-02-19 |
| 8324081 | Wafer level surface passivation of stackable integrated circuit chips | Simon J. S. McElrea, Terrence Caskey, DeAnn Eileen Melcher, Reynaldo Co, Lawrence Douglas Andrews, JR. +5 more | 2012-12-04 |
| 7923349 | Wafer level surface passivation of stackable integrated circuit chips | Simon J. S. McElrea, Terrence Caskey, DeAnn Eileen Melcher, Reynaldo Co, Lawrence Douglas Andrews, JR. +5 more | 2011-04-12 |