Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211821 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2025-01-28 |
| 11735563 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2023-08-22 |
| 11189595 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2021-11-30 |
| 10756049 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2020-08-25 |
| 9761558 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2017-09-12 |
| 9659848 | Stiffened wires for offset BVA | Grant Villavicencio, Sangil Lee, Javier A. Delacruz, Scott McGrath | 2017-05-23 |
| 9601454 | Method of forming a component having wire bonds and a stiffening layer | Zhijun Zhao | 2017-03-21 |
| 9252122 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2016-02-02 |
| 9136254 | Microelectronic package having wire bond vias and stiffening layer | Zhijun Zhao | 2015-09-15 |
| 9105483 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2015-08-11 |
| 9041227 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2015-05-26 |
| 8836136 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang +1 more | 2014-09-16 |
| 8404520 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2013-03-26 |