Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211821 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang | 2025-01-28 |
| 11735563 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang | 2023-08-22 |
| 11189595 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang | 2021-11-30 |
| 10756049 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang | 2020-08-25 |
| 10181455 | 3D thin profile pre-stacking architecture using reconstitution method | Jun Zhai, Chonghua Zhong, Kunzhong Hu | 2019-01-15 |
| 9761558 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang | 2017-09-12 |
| 9659907 | Double side mounting memory integration in thin low warpage fanout package | Jun Zhai, Kunzhong Hu, Chonghua Zhong, Mengzhi Pang | 2017-05-23 |
| 9633974 | System in package fan out stacking architecture and process flow | Jun Zhai, Kunzhong Hu, Kwan-Yu Lai, Mengzhi Pang, Chonghua Zhong | 2017-04-25 |
| 9601398 | Thin wafer handling and known good die test method | Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey, Cyprian Emeka Uzoh | 2017-03-21 |
| 9252122 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang | 2016-02-02 |
| 9236355 | EMI shielded wafer level fan-out pop package | Jun Zhai, Mengzhi Pang, Leland W. Lew | 2016-01-12 |
| 9105483 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang | 2015-08-11 |
| 9041227 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang | 2015-05-26 |
| 8978247 | TSV fabrication using a removable handling structure | Cyprian Emeka Uzoh, Michael Van Huynh, Rajesh Katkar | 2015-03-17 |
| 8846447 | Thin wafer handling and known good die test method | Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey, Cyprian Emeka Uzoh | 2014-09-30 |
| 8836136 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang +1 more | 2014-09-16 |
| 8404520 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang | 2013-03-26 |
| 7884487 | Rotation joint and semiconductor device having the same | Wang-Ju Lee | 2011-02-08 |
| 7777308 | Integrated circuit packages including sinuous lead frames | Sun-Won Kang, Yeo-Hoon Yoon | 2010-08-17 |
| 7692314 | Wafer level chip scale package and method for manufacturing the same | Wang-Ju Lee | 2010-04-06 |