Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113142 | Strings of solar cells having laser assisted metallization conductive contact structures and their methods of manufacture | Pei Hsuan Lu, Tyler D. Newman, Paul Loscutoff, George G. Correos, Yafu Lin +11 more | 2024-10-08 |
| 12080815 | Laser assisted metallization process for solar cell stringing | Pei Hsuan Lu, Benjamin Ian Hsia, David Aaron Randolph Barkhouse, Lewis Abra, George G. Correos +5 more | 2024-09-03 |
| 11664472 | Laser assisted metallization process for solar cell stringing | Pei Hsuan Lu, Benjamin Ian Hsia, David Aaron Randolph Barkhouse, Lewis Abra, George G. Correos +5 more | 2023-05-30 |
| 9824999 | Semiconductor die mount by conformal die coating | Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, De Ann Eileen Melcher | 2017-11-21 |
| 9305862 | Support mounted electrically interconnected die assembly | Simon J. S. McElrea, Lawrence Douglas Andrews, JR. | 2016-04-05 |
| 9252116 | Semiconductor die mount by conformal die coating | Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, De Ann Eileen Melcher | 2016-02-02 |
| 8729690 | Assembly having stacked die mounted on substrate | Al Vindasius, Larry Jacobsen, Donald Almen | 2014-05-20 |
| 8723332 | Electrically interconnected stacked die assemblies | Simon J. S. McElrea, Lawrence Douglas Andrews, JR., Scott McGrath, Terrence Caskey, Scott Jay Crane +1 more | 2014-05-13 |
| 8704379 | Semiconductor die mount by conformal die coating | Scott Jay Crane, Simon J. S. McElrea, Scott McGrath, Weiping Pan, DeAnn Eileen Melcher | 2014-04-22 |
| 8629543 | Electrically interconnected stacked die assemblies | Simon J. S. McElrea, Lawrence Douglas Andrews, JR., Scott McGrath, Terrence Caskey, Scott Jay Crane +1 more | 2014-01-14 |
| 8357999 | Assembly having stacked die mounted on substrate | Alfons Vindasius, Donald Almen, Larry Jacobsen | 2013-01-22 |
| 8178978 | Support mounted electrically interconnected die assembly | Simon J. S. McElrea, Lawrence Douglas Andrews, JR. | 2012-05-15 |
| 7705432 | Three dimensional six surface conformal die coating | Al Vindasius | 2010-04-27 |
| 7535109 | Die assembly having electrical interconnect | Alfons Vindasius, Donald Almen, Larry Jacobsen | 2009-05-19 |
| 7245021 | Micropede stacked die component assembly | Al Vindasius, Larry Jacobsen, Donald Almen | 2007-07-17 |
| 7215018 | Stacked die BGA or LGA component assembly | Al Vindasius, Larry Jacobsen, Donald Almen | 2007-05-08 |
| 6271598 | Conductive epoxy flip-chip on chip | Alfons Vindasius, William R. Scharrenberg | 2001-08-07 |
| 6098278 | Method for forming conductive epoxy flip-chip on chip | Alfons Vindasius, William R. Scharrenberg | 2000-08-08 |