Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8357999 | Assembly having stacked die mounted on substrate | Marc E. Robinson, Donald Almen, Larry Jacobsen | 2013-01-22 |
| 7535109 | Die assembly having electrical interconnect | Marc E. Robinson, Donald Almen, Larry Jacobsen | 2009-05-19 |
| 6271598 | Conductive epoxy flip-chip on chip | Marc E. Robinson, William R. Scharrenberg | 2001-08-07 |
| 6255726 | Vertical interconnect process for silicon segments with dielectric isolation | Kenneth M. Sautter | 2001-07-03 |
| 6177296 | Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform | Kenneth M. Sautter | 2001-01-23 |
| 6124633 | Vertical interconnect process for silicon segments with thermally conductive epoxy preform | Kenneth M. Sautter | 2000-09-26 |
| 6098278 | Method for forming conductive epoxy flip-chip on chip | Marc E. Robinson, William R. Scharrenberg | 2000-08-08 |
| 6080596 | Method for forming vertical interconnect process for silicon segments with dielectric isolation | Kenneth M. Sautter | 2000-06-27 |
| 5891761 | Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform | Kenneth M. Sautter | 1999-04-06 |