| 8729690 |
Assembly having stacked die mounted on substrate |
Al Vindasius, Marc E. Robinson, Donald Almen |
2014-05-20 |
| 8357999 |
Assembly having stacked die mounted on substrate |
Marc E. Robinson, Alfons Vindasius, Donald Almen |
2013-01-22 |
| 7535109 |
Die assembly having electrical interconnect |
Marc E. Robinson, Alfons Vindasius, Donald Almen |
2009-05-19 |
| 7245021 |
Micropede stacked die component assembly |
Al Vindasius, Marc E. Robinson, Donald Almen |
2007-07-17 |
| 7215018 |
Stacked die BGA or LGA component assembly |
Al Vindasius, Marc E. Robinson, Donald Almen |
2007-05-08 |
| 6130113 |
Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process |
Mohammad Eslamy |
2000-10-10 |
| 5973398 |
Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate |
Mohammad Eslamy |
1999-10-26 |
