Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8729690 | Assembly having stacked die mounted on substrate | Al Vindasius, Marc E. Robinson, Donald Almen | 2014-05-20 |
| 8357999 | Assembly having stacked die mounted on substrate | Marc E. Robinson, Alfons Vindasius, Donald Almen | 2013-01-22 |
| 7535109 | Die assembly having electrical interconnect | Marc E. Robinson, Alfons Vindasius, Donald Almen | 2009-05-19 |
| 7245021 | Micropede stacked die component assembly | Al Vindasius, Marc E. Robinson, Donald Almen | 2007-07-17 |
| 7215018 | Stacked die BGA or LGA component assembly | Al Vindasius, Marc E. Robinson, Donald Almen | 2007-05-08 |
| 6130113 | Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process | Mohammad Eslamy | 2000-10-10 |
| 5973398 | Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate | Mohammad Eslamy | 1999-10-26 |