Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Mohammad Eslamy — 14 Patents

FOFormfactor: 5 patents #32 of 177Top 20%
GSGem Services: 4 patents #8 of 19Top 45%
Intel: 3 patents #10,444 of 30,777Top 35%
LSLsi: 2 patents #1,885 of 3,238Top 60%
San Jose, CA: #4,673 of 32,062 inventorsTop 15%
California: #43,920 of 386,348 inventorsTop 15%
Overall (All Time): #332,869 of 4,157,543Top 9%
14 Patents All Time
Mohammad Eslamy has been granted 14 US patents while listed as an inventor at Formfactor. The first was granted in 1999 and the most recent in February 2012. Mohammad Eslamy ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Mohammad Eslamy in San Jose, CA, US.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
8120154 Interconnection of lead frame to die utilizing flip chip process Anthony C. Tsui 2012-02-21
8106493 Semiconductor device package having features formed by stamping Anthony C. Tsui, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu 2012-01-31
8011089 Method of repairing segmented contactor David V. Pedersen, Harry D. Cobb 2011-09-06 $1,949,000
7838339 Semiconductor device package having features formed by stamping Anthony C. Tsui, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu 2010-11-23
7691670 Interconnection of lead frame to die utilizing flip chip process Anthony C. Tsui 2010-04-06
7578057 Method of fabricating segmented contactor David V. Pedersen, Harry D. Cobb 2009-08-25 $3,076,000
7215131 Segmented contactor David V. Pedersen, Harry D. Cobb 2007-05-08 $21,538,000
7065870 Segmented contactor David V. Pedersen, Harry D. Cobb 2006-06-27 $22,828,000
6784536 Symmetric stack up structure for organic BGA chip carriers 2004-08-31 $37,228,000
6640415 Segmented contactor David V. Pedersen, Harry D. Cobb 2003-11-04 $3,350,000
6596618 Increased solder-bump height for improved flip-chip bonding and reliability Kollengode S. Narayanan 2003-07-22 $88,807,000
6485843 Apparatus and method for mounting BGA devices 2002-11-26 $43,433,000
6130113 Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process Larry Jacobsen 2000-10-10 $16,726,000
5973398 Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate Larry Jacobsen 1999-10-26 $6,392,000