| 8120154 |
Interconnection of lead frame to die utilizing flip chip process |
Anthony C. Tsui |
2012-02-21 |
| 8106493 |
Semiconductor device package having features formed by stamping |
Anthony C. Tsui, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu |
2012-01-31 |
| 8011089 |
Method of repairing segmented contactor |
David V. Pedersen, Harry D. Cobb |
2011-09-06 |
| 7838339 |
Semiconductor device package having features formed by stamping |
Anthony C. Tsui, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu |
2010-11-23 |
| 7691670 |
Interconnection of lead frame to die utilizing flip chip process |
Anthony C. Tsui |
2010-04-06 |
| 7578057 |
Method of fabricating segmented contactor |
David V. Pedersen, Harry D. Cobb |
2009-08-25 |
| 7215131 |
Segmented contactor |
David V. Pedersen, Harry D. Cobb |
2007-05-08 |
| 7065870 |
Segmented contactor |
David V. Pedersen, Harry D. Cobb |
2006-06-27 |
| 6784536 |
Symmetric stack up structure for organic BGA chip carriers |
— |
2004-08-31 |
| 6640415 |
Segmented contactor |
David V. Pedersen, Harry D. Cobb |
2003-11-04 |
| 6596618 |
Increased solder-bump height for improved flip-chip bonding and reliability |
Kollengode S. Narayanan |
2003-07-22 |
| 6485843 |
Apparatus and method for mounting BGA devices |
— |
2002-11-26 |
| 6130113 |
Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process |
Larry Jacobsen |
2000-10-10 |
| 5973398 |
Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate |
Larry Jacobsen |
1999-10-26 |
