Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8120154 | Interconnection of lead frame to die utilizing flip chip process | Anthony C. Tsui | 2012-02-21 |
| 8106493 | Semiconductor device package having features formed by stamping | Anthony C. Tsui, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu | 2012-01-31 |
| 8011089 | Method of repairing segmented contactor | David V. Pedersen, Harry D. Cobb | 2011-09-06 |
| 7838339 | Semiconductor device package having features formed by stamping | Anthony C. Tsui, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu | 2010-11-23 |
| 7691670 | Interconnection of lead frame to die utilizing flip chip process | Anthony C. Tsui | 2010-04-06 |
| 7578057 | Method of fabricating segmented contactor | David V. Pedersen, Harry D. Cobb | 2009-08-25 |
| 7215131 | Segmented contactor | David V. Pedersen, Harry D. Cobb | 2007-05-08 |
| 7065870 | Segmented contactor | David V. Pedersen, Harry D. Cobb | 2006-06-27 |
| 6784536 | Symmetric stack up structure for organic BGA chip carriers | — | 2004-08-31 |
| 6640415 | Segmented contactor | David V. Pedersen, Harry D. Cobb | 2003-11-04 |
| 6596618 | Increased solder-bump height for improved flip-chip bonding and reliability | Kollengode S. Narayanan | 2003-07-22 |
| 6485843 | Apparatus and method for mounting BGA devices | — | 2002-11-26 |
| 6130113 | Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process | Larry Jacobsen | 2000-10-10 |
| 5973398 | Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate | Larry Jacobsen | 1999-10-26 |