| 8558368 |
Bi-directional, reverse blocking battery switch |
James Harnden, Liming Wong, Hongbo Yang, Anthony C. Tsui, Hui Teng +1 more |
2013-10-15 |
| 8106493 |
Semiconductor device package having features formed by stamping |
Anthony C. Tsui, Mohammad Eslamy, Hongbo Yang, Ming Zhou, Jian Xu |
2012-01-31 |
| 8097945 |
Bi-directional, reverse blocking battery switch |
James Harnden, Liming Wong, Hongbo Yang, Anthony C. Tsui, Hui Teng +1 more |
2012-01-17 |
| 7838339 |
Semiconductor device package having features formed by stamping |
Anthony C. Tsui, Mohammad Eslamy, Hongbo Yang, Ming Zhou, Jian Xu |
2010-11-23 |
| 7667309 |
Space-efficient package for laterally conducting device |
James Harnden, Allen K. Lam, Richard K. Williams, Chu Weibing |
2010-02-23 |
| 7553700 |
Chemical-enhanced package singulation process |
Hamza Yilmaz, Xiaoguang Zeng, Wong Hie Ming, Liming Wang, Yiju Zhang |
2009-06-30 |
| D588557 |
4040-28J matrix leadframe |
James Harnden, Hongbo Yang, Teng Hui |
2009-03-17 |
| D588080 |
2021-8J matrix leadframe |
James Harnden, Hongbo Yang, Teng Hui |
2009-03-10 |
| 7485498 |
Space-efficient package for laterally conducting device |
James Harnden, Allen K. Lam, Richard K. Williams, Chu Weibing |
2009-02-03 |
| 7382044 |
Semiconductor device package diepad having features formed by electroplating |
Hamza Yilmaz, Seishi Fujimaki, Xiaoguang Zeng |
2008-06-03 |
| D560623 |
Quad-24JW surface mount package |
James Harnden, Liming Wong, Hongbo Yang |
2008-01-29 |
| D558694 |
Quad-28JW surface mount package |
James Harnden, Liming Wong, Hongbo Yang |
2008-01-01 |
| 7215012 |
Space-efficient package for laterally conducting device |
James Harnden, Allen K. Lam, Richard K. Williams, Chu Weibing |
2007-05-08 |
| 7122406 |
Semiconductor device package diepad having features formed by electroplating |
Hamza Yilmaz, Seishi Fujimaki, Xiaoguang Zeng |
2006-10-17 |
| 7057273 |
Surface mount package |
James Harnden, Richard K. Williams, Chu Weibing |
2006-06-06 |
| D513608 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Chu Weibing, Allen K. Lam |
2006-01-17 |
| D505121 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Chu Weibing, Allen K. Lam |
2005-05-17 |
| D505122 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Chu Weibing, Allen K. Lam |
2005-05-17 |
| D494939 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Chu Weibing |
2004-08-24 |
| D492266 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Chu Weibing |
2004-06-29 |
| D491900 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Chu Weibing |
2004-06-22 |
| D488136 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Chu Weibing, Allen K. Lam |
2004-04-06 |
| D487432 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Chu Weibing |
2004-03-09 |
| D487431 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Chu Weibing, Allen K. Lam |
2004-03-09 |
| D486802 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Chu Weibing |
2004-02-17 |