Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8558368 | Bi-directional, reverse blocking battery switch | James Harnden, Liming Wong, Hongbo Yang, Anthony C. Tsui, Hui Teng +1 more | 2013-10-15 |
| 8106493 | Semiconductor device package having features formed by stamping | Anthony C. Tsui, Mohammad Eslamy, Hongbo Yang, Ming Zhou, Jian Xu | 2012-01-31 |
| 8097945 | Bi-directional, reverse blocking battery switch | James Harnden, Liming Wong, Hongbo Yang, Anthony C. Tsui, Hui Teng +1 more | 2012-01-17 |
| 7838339 | Semiconductor device package having features formed by stamping | Anthony C. Tsui, Mohammad Eslamy, Hongbo Yang, Ming Zhou, Jian Xu | 2010-11-23 |
| 7667309 | Space-efficient package for laterally conducting device | James Harnden, Allen K. Lam, Richard K. Williams, Chu Weibing | 2010-02-23 |
| 7553700 | Chemical-enhanced package singulation process | Hamza Yilmaz, Xiaoguang Zeng, Wong Hie Ming, Liming Wang, Yiju Zhang | 2009-06-30 |
| D588557 | 4040-28J matrix leadframe | James Harnden, Hongbo Yang, Teng Hui | 2009-03-17 |
| D588080 | 2021-8J matrix leadframe | James Harnden, Hongbo Yang, Teng Hui | 2009-03-10 |
| 7485498 | Space-efficient package for laterally conducting device | James Harnden, Allen K. Lam, Richard K. Williams, Chu Weibing | 2009-02-03 |
| 7382044 | Semiconductor device package diepad having features formed by electroplating | Hamza Yilmaz, Seishi Fujimaki, Xiaoguang Zeng | 2008-06-03 |
| D560623 | Quad-24JW surface mount package | James Harnden, Liming Wong, Hongbo Yang | 2008-01-29 |
| D558694 | Quad-28JW surface mount package | James Harnden, Liming Wong, Hongbo Yang | 2008-01-01 |
| 7215012 | Space-efficient package for laterally conducting device | James Harnden, Allen K. Lam, Richard K. Williams, Chu Weibing | 2007-05-08 |
| 7122406 | Semiconductor device package diepad having features formed by electroplating | Hamza Yilmaz, Seishi Fujimaki, Xiaoguang Zeng | 2006-10-17 |
| 7057273 | Surface mount package | James Harnden, Richard K. Williams, Chu Weibing | 2006-06-06 |
| D513608 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Chu Weibing, Allen K. Lam | 2006-01-17 |
| D505121 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Chu Weibing, Allen K. Lam | 2005-05-17 |
| D505122 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Chu Weibing, Allen K. Lam | 2005-05-17 |
| D494939 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Chu Weibing | 2004-08-24 |
| D492266 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Chu Weibing | 2004-06-29 |
| D491900 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Chu Weibing | 2004-06-22 |
| D488136 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Chu Weibing, Allen K. Lam | 2004-04-06 |
| D487432 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Chu Weibing | 2004-03-09 |
| D487431 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Chu Weibing, Allen K. Lam | 2004-03-09 |
| D486802 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Chu Weibing | 2004-02-17 |