Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7382044 | Semiconductor device package diepad having features formed by electroplating | Hamza Yilmaz, Anthony Chia, Xiaoguang Zeng | 2008-06-03 |
| 7122406 | Semiconductor device package diepad having features formed by electroplating | Hamza Yilmaz, Anthony Chia, Xiaoguang Zeng | 2006-10-17 |