Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261101 | Semiconductor package having wettable lead flanks and tie bars and method of making the same | Yan Xun Xue, Madhur Bobde, Long Wang | 2025-03-25 |
| 12142548 | Semiconductor package having mold locking feature | Yan Xun Xue, Long Wang, Mary Jane R. Alin, Hailin Zhou, Guobing Shen | 2024-11-12 |
| 10600727 | Molded intelligent power module for motors | Zhiqiang Niu, Bum Seok Suh, Jun Lu, Son Tran, Wanki Hong +2 more | 2020-03-24 |
| 9437587 | Flip chip semiconductor device | Xiaotian Zhang, Hamza Yilmaz, Jun Lu, Ming-Chen Lu | 2016-09-06 |
| 8669650 | Flip chip semiconductor device | Xiaotian Zhang, Hamza Yilmaz, Jun Lu, Ming-Chen Lu | 2014-03-11 |
| 7553700 | Chemical-enhanced package singulation process | Hamza Yilmaz, Anthony Chia, Wong Hie Ming, Liming Wang, Yiju Zhang | 2009-06-30 |
| 7382044 | Semiconductor device package diepad having features formed by electroplating | Hamza Yilmaz, Anthony Chia, Seishi Fujimaki | 2008-06-03 |
| 7122406 | Semiconductor device package diepad having features formed by electroplating | Hamza Yilmaz, Anthony Chia, Seishi Fujimaki | 2006-10-17 |