Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249562 | Intelligent power module containing exposed surfaces of transistor die supporting elements | Bum Seok Suh, Junho Lee, Jong-Mu Lee, Xiaorong Ge | 2025-03-11 |
| D1042375 | Power semiconductor module | Bum Seok Suh, Jong-Mu Lee, Jia-long Yuan, Junho Lee, Xiaorong Ge | 2024-09-17 |
| D1037187 | Power semiconductor module | Bum Seok Suh, Jong-Mu Lee, Jia-long Yuan, Junho Lee, Xiaorong Ge | 2024-07-30 |
| 12015336 | Power converter for high power density applications | Ziwei Yu, Lin Chen | 2024-06-18 |
| 11750089 | Power converter for high power density | Ziwei Yu, Lin Chen | 2023-09-05 |
| 11699627 | DMOS FET chip scale package and method of making the same | Yan Xun Xue, Long Wang, Hongyong Xue, Madhur Bobde, Jun Lu | 2023-07-11 |
| 11417648 | Intelligent power module containing IGBT and super-junction MOSFET | Bum Seok Suh, Madhur Bobde, Junho Lee, Xiaojing Xu, Zhaorong Zhuang | 2022-08-16 |
| 11222858 | Semiconductor package having enlarged gate pad and method of making the same | Yan Xun Xue, Yueh-Se Ho, Long Wang, Xiaotian Zhang | 2022-01-11 |
| 11101137 | Method of making reverse conducting insulated gate bipolar transistor | Long Wang, Yueh-Se Ho, Lingpeng Guan, Wenjun Li | 2021-08-24 |
| 11069604 | Semiconductor package and method of making the same | Xiaotian Zhang, Yan Xun Xue, Long Wang, Yueh-Se Ho | 2021-07-20 |
| 10763221 | HV converter with reduced EMI | Kuang Ming Chang, Lin Chen, Ning Sun, Qihong Huang, Tzu-Hsin Lu | 2020-09-01 |
| 10600727 | Molded intelligent power module for motors | Bum Seok Suh, Jun Lu, Son Tran, Wanki Hong, Guobing Shen +2 more | 2020-03-24 |
| 10438900 | HV converter with reduced EMI | Kuang Ming Chang, Lin Chen, Ning Sun, Qihong Huang | 2019-10-08 |
| 10396019 | Molded intelligent power module and method of making the same | Bum Seok Suh, Wonjin Cho, Jun Lu | 2019-08-27 |
| 10177080 | Molded intelligent power module | Bum Seok Suh, Jun Lu, Wonjin Cho | 2019-01-08 |
| 10141249 | Molded intelligent power module and method of making the same | Bum Seok Suh, Wonjin Cho, Jun Lu | 2018-11-27 |
| 10056893 | Molded power module having single in-line leads | Bum Seok Suh, Wonjin Cho, Son Tran, James Rachana Bou | 2018-08-21 |
| 10043736 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo +1 more | 2018-08-07 |
| 9966328 | Semiconductor power device having single in-line lead module and method of making the same | Yan Xun Xue | 2018-05-08 |
| 9881856 | Molded intelligent power module | Bum Seok Suh, Wonjin Cho, Cheow Khoon Oh, Son Tran, James Rachana Bou | 2018-01-30 |
| 9837386 | Power device and preparation method thereof | Xiaotian Zhang, Shekar Mallikarjunaswamy, Cheow Khoon Oh, Yueh-Se Ho | 2017-12-05 |
| 9768146 | Battery protection package and process of making the same | Yan Xun Xue, Man Sheng Hu, Jun Lu, Yueh-Se Ho, Hamza Yilmaz | 2017-09-19 |
| 9754864 | Semiconductor power device having single in-line lead module and method of making the same | Yan Xun Xue | 2017-09-05 |
| 9704789 | Molded intelligent power module | Bum Seok Suh, Wonjin Cho, Cheow Khoon Oh, Son Tran, James Rachana Bou | 2017-07-11 |
| 9685430 | Embedded package and method thereof | Hua Pan, Ming-Chen Lu, Yueh-Se Ho, Jun Lu | 2017-06-20 |